Abstract: A phenolic polymer obtained by reacting a phenolic compound with a bis(hydroxyalkyl)benzene, followed by alkylation of ortho positions or para position with respect to the hydroxyl group of the terminal phenol groups of the produced polymer is suitable for use as a heat resistant antioxidant for thermoplastic resins.

Abstract: A heat-resistant resin paste consisting essentially of a first organic liquid (A.sub.1), a second organic liquid (A.sub.2), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting essentially of the first organic liquid (A.sub.1) and the second organic liquid (A.sub.2), and fine particles of a heat-resistant resin (C) which are soluble in the first organic liquid (A.sub.1), but insoluble in the second organic liquid (A.sub.2). The first organic liquid (A.sub.1), the second organic liquid (A.sub.2), and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.

Abstract: 1,3-Bis(dicarboxyphenyl)-1,1,3,3-tetraphenyldisiloxane derivatives useful as raw materials of polyimide resins, hardeners for epoxy resins and others and process for producing these derivatives, and polyamic acid and polyamic acid ester, and polyimide resins and processes for producing them from said disiloxane derivatives. The polyimide resins are good in properties such as adhesion to silicon substrates, heat resistance and mechanical properties.

Abstract: A phenolic polymer obtained by reacting a phenolic compound with a bis(hydroxyalkyl)benzene, followed by alkylation of ortho positions or para position with respect to the hydroxyl group of the terminal phenol groups of the produced polymer is suitable for use as a heat resistant antioxidant for thermoplastic resins

Abstract: A polyimide obtained from a polyamide-acid or polyamide-acid ester prepared by reacting dicyclohexyl-3,4,3', 4'-tetracarboxylic acid or dinanhydride with a diamine is excellent in transparency, heat resistance and mechanical properties, said polyimide being able to be obtained at a lower temperature, and particularly suitable for an orientation film used in a liquid crystal display device.

Abstract: Disclosed are a para- or meta-terphenyl-3,4,3",4"-tetracarboxylic acid or a dianhydride and a process for preparing the same. The para- or meta-terphenyl-3,4,3",4"-tetracarboxylic acid or a dianhydride thereof according to the present invention is a novel compound which is useful as a raw material for a polyimide having higher heat resistance and so on.

Abstract: A synthetic resin composition comprising a synthetic resin and a special phenolic polymer is stabilized for a long period of time and excellent in heat resistance and light resistance.