Patents by Inventor Tohru Kitano

Tohru Kitano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11046043
    Abstract: Provided is a linerless thermosensitive recording body package, a roll of a linerless thermosensitive recording sheet being packaged in the linerless thermosensitive recording body package, the linerless thermosensitive recording sheet including a support, a thermosensitive color developing layer over one surface of the support, a release layer over the thermosensitive color developing layer, and an adhesive layer over an opposite surface of the support, the linerless thermosensitive recording sheet being wound in roll shape in a manner that the adhesive layer comes to an internal side of the support, wherein a peel force for peeling the linerless thermosensitive recording sheet from the roll is 50 mN/50 mm or greater but 250 mN/50 mm or less, wherein a water content of the linerless thermosensitive recording sheet is 4.5% or higher but 6.5% or lower, the roll of the linerless thermosensitive recording sheet being seal-packaged in the linerless thermosensitive recording body package.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: June 29, 2021
    Assignee: Ricoh Company, Ltd.
    Inventors: Tohru Kitano, Tomohisa Kakuda, Hiroaki Matsui
  • Patent number: 10607509
    Abstract: A linerless label including a support, a release layer over one surface of the support, and an adhesive layer over another surface of the support, wherein when the linerless label is cut with an apparatus including a mechanism in which an upper blade of cutter blades is immobilized and a lower blade of the cutter blades is configured to move upward, in a manner that the lower blade is inserted into the linerless label from a side of the linerless label at which the adhesive layer is provided, a cutter load voltage during a cutter operation performed after the linerless label is cut five thousand times repeatedly has a difference of less than or equal to 2.0 V from the cutter load voltage during cutting of a label support, which is the linerless label before treated to have adhesiveness.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: March 31, 2020
    Assignee: Ricoh Company, Ltd.
    Inventors: Yasufumi Oda, Tohru Kitano
  • Publication number: 20200023663
    Abstract: Provided is a linerless thermosensitive recording body package, a roll of a linerless thermosensitive recording sheet being packaged in the linerless thermosensitive recording body package, the linerless thermosensitive recording sheet including a support, a thermosensitive color developing layer over one surface of the support, a release layer over the thermosensitive color developing layer, and an adhesive layer over an opposite surface of the support, the linerless thermosensitive recording sheet being wound in roll shape in a manner that the adhesive layer comes to an internal side of the support, wherein a peel force for peeling the linerless thermosensitive recording sheet from the roll is 50 mN/50 mm or greater but 250 mN/50 mm or less, wherein a water content of the linerless thermosensitive recording sheet is 4.5% or higher but 6.5% or lower, the roll of the linerless thermosensitive recording sheet being seal-packaged in the linerless thermosensitive recording body package.
    Type: Application
    Filed: March 12, 2018
    Publication date: January 23, 2020
    Inventors: Tohru KITANO, Tomohisa KAKUDA, Hiroaki MATSUI
  • Publication number: 20180061281
    Abstract: A linerless label including a support, a release layer over one surface of the support, and an adhesive layer over another surface of the support, wherein when the linerless label is cut with an apparatus including a mechanism in which an upper blade of cutter blades is immobilized and a lower blade of the cutter blades is configured to move upward, in a manner that the lower blade is inserted into the linerless label from a side of the linerless label at which the adhesive layer is provided, a cutter load voltage during a cutter operation performed after the linerless label is cut five thousand times repeatedly has a difference of less than or equal to 2.0 V from the cutter load voltage during cutting of a label support, which is the linerless label before treated to have adhesiveness.
    Type: Application
    Filed: March 11, 2016
    Publication date: March 1, 2018
    Inventors: Yasufumi ODA, Tohru KITANO
  • Patent number: 8709974
    Abstract: A thermosensitive recording medium including a support, and a thermosensitive recording layer containing a leuco dye and a developer, and formed on a surface of the support, wherein the thermosensitive recording medium comprises at least any one of diiodomethyl-p-tolylsulfone and 3-iodo-2-propynyl-butyl-carbamate.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: April 29, 2014
    Assignee: Ricoh Company, Ltd.
    Inventor: Tohru Kitano
  • Patent number: 8367581
    Abstract: To provide a thermosensitive recording medium including: a support; a thermosensitive recording layer composed mainly of a leuco dye and a developer, formed on a surface of the support; and at least two antibacterial agents which include a zirconium phosphate antibacterial agent and an imidazole antibacterial agent and which are internally contained in the thermosensitive recording medium.
    Type: Grant
    Filed: September 14, 2009
    Date of Patent: February 5, 2013
    Assignee: Ricoh Company, Ltd.
    Inventor: Tohru Kitano
  • Patent number: 8168565
    Abstract: A thermal recording adhesive label, including a substrate; a thermal recording layer located overlying one side of the substrate, including a leuco dye and a color developer; a back coat layer located overlying the other side of the substrate; an adhesive layer located overlying the back coat layer; and a release paper located overlying the adhesive layer, wherein the thermal recording adhesive label further includes an adhesive undercoat layer comprising a thermoplastic resin and a filler between the back coat layer and the adhesive layer.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: May 1, 2012
    Assignee: Ricoh Company, Ltd.
    Inventor: Tohru Kitano
  • Publication number: 20110230341
    Abstract: A thermosensitive recording medium including a support, and a thermosensitive recording layer containing a leuco dye and a developer, and formed on a surface of the support, wherein the thermosensitive recording medium comprises at least any one of diiodomethyl-p-tolylsulfone and 3-iodo-2-propynyl-butyl-carbamate.
    Type: Application
    Filed: March 15, 2011
    Publication date: September 22, 2011
    Applicant: RICOH COMPANY, LTD.
    Inventor: Tohru KITANO
  • Patent number: 7811661
    Abstract: In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is ?70° C. or higher and below 0° C.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: October 12, 2010
    Assignee: Ricoh Company, Ltd.
    Inventors: Hiroshi Goto, Tomoyuki Kugo, Mitsunobu Morita, Norihiko Inaba, Tohru Kitano, Takehito Yamaguchi
  • Publication number: 20100069241
    Abstract: To provide a thermosensitive recording medium including: a support; a thermosensitive recording layer composed mainly of a leuco dye and a developer, formed on a surface of the support; and at least two antibacterial agents which include a zirconium phosphate antibacterial agent and an imidazole antibacterial agent and which are internally contained in the thermosensitive recording medium.
    Type: Application
    Filed: September 14, 2009
    Publication date: March 18, 2010
    Applicant: RICOH COMPANY, LTD.
    Inventor: Tohru KITANO
  • Publication number: 20090209419
    Abstract: A thermal recording adhesive label, including a substrate; a thermal recording layer located overlying one side of the substrate, including a leuco dye and a color developer; a back coat layer located overlying the other side of the substrate; an adhesive layer located overlying the back coat layer; and a release paper located overlying the adhesive layer, wherein the thermal recording adhesive label further includes an adhesive undercoat layer comprising a thermoplastic resin and a filler between the back coat layer and the adhesive layer.
    Type: Application
    Filed: February 6, 2009
    Publication date: August 20, 2009
    Applicant: RICOH COMPANY, LTD.
    Inventor: Tohru KITANO
  • Publication number: 20080070035
    Abstract: A thermosensitive adhesive composition containing a thermoplastic resin, an adhesiveness imparting agent and a solid plasticizing agent containing a dispersing agent, wherein the dispersing agent is a polyvinyl alcohol based resin having a weight average molecular weight of from 11,000 to 39,000.
    Type: Application
    Filed: September 18, 2006
    Publication date: March 20, 2008
    Inventors: Tohru Kitano, Tomoyuki Kugoh, Norihiko Inaba
  • Publication number: 20060159913
    Abstract: The object of the present invention is to provide a heat-sensitive adhesive material having improved delivery properties and a superior adhesive strength. The objective heat-sensitive adhesive material in which an adhesive layer comprising mainly an adhesive is coated over a support and a heat-sensitive adhesive layer having developed adhesion by heating and maintaining the developed adhesive strength is coated over the adhesive layer, has Clark stiffness set by JIS P-8143 of 30 m3/100 to 180 cm3/100 in a longitudinal direction and a coefficient of static friction between a heat-sensitive layer and a polyethylene terephthalate (PET) film of 0.90 or less.
    Type: Application
    Filed: December 21, 2005
    Publication date: July 20, 2006
    Inventors: Tomoyuki Kugo, Tohru Kitano, Norihiko Inaba
  • Publication number: 20060068191
    Abstract: In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is ?70° C. or higher and below 0° C.
    Type: Application
    Filed: September 13, 2005
    Publication date: March 30, 2006
    Inventors: Hiroshi Goto, Tomoyuki Kugo, Mitsunobu Morita, Norihiko Inaba, Tohru Kitano, Takehito Yamaguchi
  • Patent number: 6980409
    Abstract: A high impedance can be maintained at a back gate of a MOS transistor constituting a CMOS integrated circuit when power is not supplied, and is switched to an impedance lower than the impedance in use of the CMOS integrated circuit by a switch driven by a power supply of the CMOS integrated circuit. Thus, it is possible to prevent surge breakdown and electrostatic breakdown, and to prevent occurrence of latch up breakdown.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: December 27, 2005
    Assignees: Renesas Technology Corp., Mitsubishi Electric Engineering Co., Ltd.
    Inventor: Tohru Kitano
  • Publication number: 20050094334
    Abstract: A high impedance can be maintained at a back gate of a MOS transistor constituting a CMOS integrated circuit when power is not supplied, and is switched to an impedance lower than the impedance in use of the CMOS integrated circuit by a switch driven by a power supply of the CMOS integrated circuit. Thus, it is possible to prevent surge breakdown and electrostatic breakdown, and to prevent occurrence of latch up breakdown.
    Type: Application
    Filed: December 6, 2004
    Publication date: May 5, 2005
    Inventor: Tohru Kitano
  • Patent number: 6847512
    Abstract: A high impedance can be maintained at a back gate of a MOS transistor constituting a CMOS integrated circuit when power is not supplied, and is switched to an impedance lower than the impedance in use of the CMOS integrated circuit by a switch driven by a power supply of the CMOS integrated circuit. Thus, it is possible to prevent surge breakdown and electrostatic breakdown, and to prevent occurrence of latch up breakdown.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: January 25, 2005
    Assignees: Renesas Technology Corp., Mitsubishi Electric Engineering Co., Ltd.
    Inventor: Tohru Kitano
  • Publication number: 20030193765
    Abstract: A high impedance can be maintained at a back gate of a MOS transistor constituting a CMOS integrated circuit when power is not supplied, and is switched to an impedance lower than the impedance in use of the CMOS integrated circuit by a switch driven by a power supply of the CMOS integrated circuit. Thus, it is possible to prevent surge breakdown and electrostatic breakdown, and to prevent occurrence of latch up breakdown.
    Type: Application
    Filed: October 10, 2002
    Publication date: October 16, 2003
    Inventor: Tohru Kitano