Patents by Inventor Tohru Kitano
Tohru Kitano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11046043Abstract: Provided is a linerless thermosensitive recording body package, a roll of a linerless thermosensitive recording sheet being packaged in the linerless thermosensitive recording body package, the linerless thermosensitive recording sheet including a support, a thermosensitive color developing layer over one surface of the support, a release layer over the thermosensitive color developing layer, and an adhesive layer over an opposite surface of the support, the linerless thermosensitive recording sheet being wound in roll shape in a manner that the adhesive layer comes to an internal side of the support, wherein a peel force for peeling the linerless thermosensitive recording sheet from the roll is 50 mN/50 mm or greater but 250 mN/50 mm or less, wherein a water content of the linerless thermosensitive recording sheet is 4.5% or higher but 6.5% or lower, the roll of the linerless thermosensitive recording sheet being seal-packaged in the linerless thermosensitive recording body package.Type: GrantFiled: March 12, 2018Date of Patent: June 29, 2021Assignee: Ricoh Company, Ltd.Inventors: Tohru Kitano, Tomohisa Kakuda, Hiroaki Matsui
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Patent number: 10607509Abstract: A linerless label including a support, a release layer over one surface of the support, and an adhesive layer over another surface of the support, wherein when the linerless label is cut with an apparatus including a mechanism in which an upper blade of cutter blades is immobilized and a lower blade of the cutter blades is configured to move upward, in a manner that the lower blade is inserted into the linerless label from a side of the linerless label at which the adhesive layer is provided, a cutter load voltage during a cutter operation performed after the linerless label is cut five thousand times repeatedly has a difference of less than or equal to 2.0 V from the cutter load voltage during cutting of a label support, which is the linerless label before treated to have adhesiveness.Type: GrantFiled: March 11, 2016Date of Patent: March 31, 2020Assignee: Ricoh Company, Ltd.Inventors: Yasufumi Oda, Tohru Kitano
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Publication number: 20200023663Abstract: Provided is a linerless thermosensitive recording body package, a roll of a linerless thermosensitive recording sheet being packaged in the linerless thermosensitive recording body package, the linerless thermosensitive recording sheet including a support, a thermosensitive color developing layer over one surface of the support, a release layer over the thermosensitive color developing layer, and an adhesive layer over an opposite surface of the support, the linerless thermosensitive recording sheet being wound in roll shape in a manner that the adhesive layer comes to an internal side of the support, wherein a peel force for peeling the linerless thermosensitive recording sheet from the roll is 50 mN/50 mm or greater but 250 mN/50 mm or less, wherein a water content of the linerless thermosensitive recording sheet is 4.5% or higher but 6.5% or lower, the roll of the linerless thermosensitive recording sheet being seal-packaged in the linerless thermosensitive recording body package.Type: ApplicationFiled: March 12, 2018Publication date: January 23, 2020Inventors: Tohru KITANO, Tomohisa KAKUDA, Hiroaki MATSUI
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Publication number: 20180061281Abstract: A linerless label including a support, a release layer over one surface of the support, and an adhesive layer over another surface of the support, wherein when the linerless label is cut with an apparatus including a mechanism in which an upper blade of cutter blades is immobilized and a lower blade of the cutter blades is configured to move upward, in a manner that the lower blade is inserted into the linerless label from a side of the linerless label at which the adhesive layer is provided, a cutter load voltage during a cutter operation performed after the linerless label is cut five thousand times repeatedly has a difference of less than or equal to 2.0 V from the cutter load voltage during cutting of a label support, which is the linerless label before treated to have adhesiveness.Type: ApplicationFiled: March 11, 2016Publication date: March 1, 2018Inventors: Yasufumi ODA, Tohru KITANO
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Patent number: 8709974Abstract: A thermosensitive recording medium including a support, and a thermosensitive recording layer containing a leuco dye and a developer, and formed on a surface of the support, wherein the thermosensitive recording medium comprises at least any one of diiodomethyl-p-tolylsulfone and 3-iodo-2-propynyl-butyl-carbamate.Type: GrantFiled: March 15, 2011Date of Patent: April 29, 2014Assignee: Ricoh Company, Ltd.Inventor: Tohru Kitano
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Patent number: 8367581Abstract: To provide a thermosensitive recording medium including: a support; a thermosensitive recording layer composed mainly of a leuco dye and a developer, formed on a surface of the support; and at least two antibacterial agents which include a zirconium phosphate antibacterial agent and an imidazole antibacterial agent and which are internally contained in the thermosensitive recording medium.Type: GrantFiled: September 14, 2009Date of Patent: February 5, 2013Assignee: Ricoh Company, Ltd.Inventor: Tohru Kitano
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Patent number: 8168565Abstract: A thermal recording adhesive label, including a substrate; a thermal recording layer located overlying one side of the substrate, including a leuco dye and a color developer; a back coat layer located overlying the other side of the substrate; an adhesive layer located overlying the back coat layer; and a release paper located overlying the adhesive layer, wherein the thermal recording adhesive label further includes an adhesive undercoat layer comprising a thermoplastic resin and a filler between the back coat layer and the adhesive layer.Type: GrantFiled: February 6, 2009Date of Patent: May 1, 2012Assignee: Ricoh Company, Ltd.Inventor: Tohru Kitano
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Publication number: 20110230341Abstract: A thermosensitive recording medium including a support, and a thermosensitive recording layer containing a leuco dye and a developer, and formed on a surface of the support, wherein the thermosensitive recording medium comprises at least any one of diiodomethyl-p-tolylsulfone and 3-iodo-2-propynyl-butyl-carbamate.Type: ApplicationFiled: March 15, 2011Publication date: September 22, 2011Applicant: RICOH COMPANY, LTD.Inventor: Tohru KITANO
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Patent number: 7811661Abstract: In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is ?70° C. or higher and below 0° C.Type: GrantFiled: September 13, 2005Date of Patent: October 12, 2010Assignee: Ricoh Company, Ltd.Inventors: Hiroshi Goto, Tomoyuki Kugo, Mitsunobu Morita, Norihiko Inaba, Tohru Kitano, Takehito Yamaguchi
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Publication number: 20100069241Abstract: To provide a thermosensitive recording medium including: a support; a thermosensitive recording layer composed mainly of a leuco dye and a developer, formed on a surface of the support; and at least two antibacterial agents which include a zirconium phosphate antibacterial agent and an imidazole antibacterial agent and which are internally contained in the thermosensitive recording medium.Type: ApplicationFiled: September 14, 2009Publication date: March 18, 2010Applicant: RICOH COMPANY, LTD.Inventor: Tohru KITANO
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Publication number: 20090209419Abstract: A thermal recording adhesive label, including a substrate; a thermal recording layer located overlying one side of the substrate, including a leuco dye and a color developer; a back coat layer located overlying the other side of the substrate; an adhesive layer located overlying the back coat layer; and a release paper located overlying the adhesive layer, wherein the thermal recording adhesive label further includes an adhesive undercoat layer comprising a thermoplastic resin and a filler between the back coat layer and the adhesive layer.Type: ApplicationFiled: February 6, 2009Publication date: August 20, 2009Applicant: RICOH COMPANY, LTD.Inventor: Tohru KITANO
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Publication number: 20080070035Abstract: A thermosensitive adhesive composition containing a thermoplastic resin, an adhesiveness imparting agent and a solid plasticizing agent containing a dispersing agent, wherein the dispersing agent is a polyvinyl alcohol based resin having a weight average molecular weight of from 11,000 to 39,000.Type: ApplicationFiled: September 18, 2006Publication date: March 20, 2008Inventors: Tohru Kitano, Tomoyuki Kugoh, Norihiko Inaba
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Publication number: 20060159913Abstract: The object of the present invention is to provide a heat-sensitive adhesive material having improved delivery properties and a superior adhesive strength. The objective heat-sensitive adhesive material in which an adhesive layer comprising mainly an adhesive is coated over a support and a heat-sensitive adhesive layer having developed adhesion by heating and maintaining the developed adhesive strength is coated over the adhesive layer, has Clark stiffness set by JIS P-8143 of 30 m3/100 to 180 cm3/100 in a longitudinal direction and a coefficient of static friction between a heat-sensitive layer and a polyethylene terephthalate (PET) film of 0.90 or less.Type: ApplicationFiled: December 21, 2005Publication date: July 20, 2006Inventors: Tomoyuki Kugo, Tohru Kitano, Norihiko Inaba
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Publication number: 20060068191Abstract: In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is ?70° C. or higher and below 0° C.Type: ApplicationFiled: September 13, 2005Publication date: March 30, 2006Inventors: Hiroshi Goto, Tomoyuki Kugo, Mitsunobu Morita, Norihiko Inaba, Tohru Kitano, Takehito Yamaguchi
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Patent number: 6980409Abstract: A high impedance can be maintained at a back gate of a MOS transistor constituting a CMOS integrated circuit when power is not supplied, and is switched to an impedance lower than the impedance in use of the CMOS integrated circuit by a switch driven by a power supply of the CMOS integrated circuit. Thus, it is possible to prevent surge breakdown and electrostatic breakdown, and to prevent occurrence of latch up breakdown.Type: GrantFiled: December 6, 2004Date of Patent: December 27, 2005Assignees: Renesas Technology Corp., Mitsubishi Electric Engineering Co., Ltd.Inventor: Tohru Kitano
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Publication number: 20050094334Abstract: A high impedance can be maintained at a back gate of a MOS transistor constituting a CMOS integrated circuit when power is not supplied, and is switched to an impedance lower than the impedance in use of the CMOS integrated circuit by a switch driven by a power supply of the CMOS integrated circuit. Thus, it is possible to prevent surge breakdown and electrostatic breakdown, and to prevent occurrence of latch up breakdown.Type: ApplicationFiled: December 6, 2004Publication date: May 5, 2005Inventor: Tohru Kitano
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Patent number: 6847512Abstract: A high impedance can be maintained at a back gate of a MOS transistor constituting a CMOS integrated circuit when power is not supplied, and is switched to an impedance lower than the impedance in use of the CMOS integrated circuit by a switch driven by a power supply of the CMOS integrated circuit. Thus, it is possible to prevent surge breakdown and electrostatic breakdown, and to prevent occurrence of latch up breakdown.Type: GrantFiled: October 10, 2002Date of Patent: January 25, 2005Assignees: Renesas Technology Corp., Mitsubishi Electric Engineering Co., Ltd.Inventor: Tohru Kitano
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Publication number: 20030193765Abstract: A high impedance can be maintained at a back gate of a MOS transistor constituting a CMOS integrated circuit when power is not supplied, and is switched to an impedance lower than the impedance in use of the CMOS integrated circuit by a switch driven by a power supply of the CMOS integrated circuit. Thus, it is possible to prevent surge breakdown and electrostatic breakdown, and to prevent occurrence of latch up breakdown.Type: ApplicationFiled: October 10, 2002Publication date: October 16, 2003Inventor: Tohru Kitano