Abstract: A method for manufacturing a semiconductor device, which improves the mounting reliability of the semiconductor device. A plurality of leads are sandwiched and cut between an upper mold and a lower mold. There are gaps between a post (guide rail) and a bush (rail holder) which control sliding movement of the upper mold. After the leads are sandwiched between the upper mold and the lower mold and before they are cut, the positional relation between the lower mold supporting the leads and the upper mold in contact with the lower surfaces of the leads is adjusted.

Abstract: A lead processing apparatus includes a first die unit, a second die unit that is movable relative to the first die unit, a load transmitting portion that transmits a load to the second die unit, and a stopper mechanism that stops the movement of the second die unit in a direction in which the second die unit approaches the first die unit. The stopper mechanism includes a plurality of stroke stopper pairs each having a first stroke stopper fixed to the first die unit and a second stroke stopper that is fixed to the second die unit and comes into contact with the stopper to stop the movement of the second die unit. The load transmitting portion distributes a load to a plurality of load transmission positions and transmits a press load to the second die unit. Each load transmission position is arranged coaxially with the stroke stopper pair.

Abstract: A press apparatus includes a bolster, a lower die holder that is mounted on the bolster to which a lower die (for example, die plate and die) is to be provided, a guide post that is vertically provided in the lower die holder, a guide bush that slides along the guide post, an upper die holder that is fixed to the guide bush to which an upper die (for example, punch plate and punch) is to be provided, and a heat transfer accelerating portion that contacts the guide post and the bolster and accelerates the transfer of heat from the guide post to the bolster.