Patents by Inventor Tohru Mochida

Tohru Mochida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Detection method for wire bonding failures
    Patent number: 5058797
    Abstract: Method for detecting failures in wire bonding is performed by applying a minimal voltage to bonding wire between the first and second bonding steps, between the second bonding step and bonding wire cutting step, and before the next first bonding step. Thus, whether or not the first bonding and the second bonding have been performed properly and whether or not the wire condition before the next first bonding is proper are all detected before advancing next bonding.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: October 22, 1991
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Yoshimitsu Terakado, Tohru Mochida, Nobuto Yamazaki