Patents by Inventor Tohru Nakai
Tohru Nakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8533943Abstract: A method of manufacturing a multilayer printed circuit board includes preparing a substrate having a first conductor circuit, forming on first circuit formed over substrate a film including cycloolefin resin such that an insulating layer including the resin is formed on substrate and first circuit, forming in insulating layer an opening exposing at least portion of first circuit, forming an electroless plating film covering surface of insulating layer including surface of insulating layer inside opening, forming on electroless film a plating resist layer having pattern exposing selected portions of electroless film, selected portions of electroless film including a second conductor circuit and a portion of electroless film covering opening, and forming an electrolytic plating film covering selected portions of electroless film such that a filled via conductor including an electrolytic material filling space in opening and that first circuit is connected to second circuit via conductor.Type: GrantFiled: March 24, 2009Date of Patent: September 17, 2013Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8093507Abstract: A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.Type: GrantFiled: April 8, 2009Date of Patent: January 10, 2012Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8065794Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.Type: GrantFiled: September 26, 2008Date of Patent: November 29, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda
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Patent number: 8030577Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: October 4, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8020291Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: September 20, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8018045Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: September 13, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8006377Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: August 30, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 7994433Abstract: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.Type: GrantFiled: March 24, 2009Date of Patent: August 9, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 7827680Abstract: An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10-12 seconds.Type: GrantFiled: January 6, 2004Date of Patent: November 9, 2010Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda
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Patent number: 7691189Abstract: The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.Type: GrantFiled: April 17, 2007Date of Patent: April 6, 2010Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda
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Publication number: 20090205857Abstract: A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.Type: ApplicationFiled: April 8, 2009Publication date: August 20, 2009Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090188708Abstract: A method of manufacturing a multilayer printed circuit board including preparing a substrate board having a conductor circuit formed over the substrate board, forming an interlayer resin insulating layer on the conductor circuit formed over the substrate board by press laminating on the conductor circuit a film comprising a cycloolefin resin under vacuum or reduced pressure, and forming a via hole connecting to the conductor circuit through the resin insulating layer, the forming of the via hole including plating the via hole to fill up.Type: ApplicationFiled: March 24, 2009Publication date: July 30, 2009Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090183904Abstract: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.Type: ApplicationFiled: March 24, 2009Publication date: July 23, 2009Applicant: IBIDEN CO., LTD.Inventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090145652Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.Type: ApplicationFiled: September 26, 2008Publication date: June 11, 2009Applicant: IBIDEN CO., LTD.Inventors: Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda
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Patent number: 7535095Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: September 28, 1999Date of Patent: May 19, 2009Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090090003Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: ApplicationFiled: June 25, 2008Publication date: April 9, 2009Applicant: IBIDEN CO., LTDInventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 7504719Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: July 26, 2005Date of Patent: March 17, 2009Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20080292852Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: ApplicationFiled: June 25, 2008Publication date: November 27, 2008Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20080289176Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: ApplicationFiled: June 25, 2008Publication date: November 27, 2008Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20080289864Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: ApplicationFiled: June 25, 2008Publication date: November 27, 2008Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda