Abstract: Provided is a simple light irradiation apparatus capable of performing uniform irradiation even on to a treatment area having a curved surface and capable of suppressing excessive heating caused by light irradiation. The light irradiation apparatus (10) includes a polymer gel layer (3) that covers the treatment area (2) on skin (1), an LED protective layer (6) that closely adheres to the polymer gel layer (3), and a substrate (5) on which LEDs (4) closely adhered to the LED protective layer (6) are arranged thereon. A current control apparatus (8) which lights the LEDs (4) controls irradiation intensity and stops irradiation when. reaching a demanded dose amount.

Abstract: There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.

Abstract: There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.

Abstract: There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.

Abstract: There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.

Abstract: There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.

Abstract: There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.

Abstract: A bearing unit comprises a cylindrical oil-impregnated bearing, in which a bearing bore to support a turning shaft is formed so as to enable the turning shaft to turn; a bearing holder, in which the oil-impregnated bearing is fixed by an inner bore; a first groove being formed in an axial direction on an inner circumferential surface of the oil-impregnated bearing; and a second groove being formed in an axial direction on at least one of an outer circumferential surface of the oil-impregnated bearing and an inner circumferential surface of the bearing holder. The second groove is formed so as to have a greater depth than that of the first groove. The second groove is also formed so as to have a larger cross section than that of the first groove.

Abstract: The disclosed invention provides a sintered oil-impregnated bearing equipped with a bearing hole having a clearance structure, in which a clearer boundary is formed between the bearing surface and the clearance surface, and a manufacturing method thereof. In a bearing hole of a radial bearing, a bearing surface and another bearing surface are formed at both ends in an axial direction, and a clearance surface is formed between both the bearing surface and the bearing surface. The bearing surfaces are formed by a sizing step for a compression-molded piece that is formed by a compression molding step. In the sizing step, diameter-reduction manufacturing is carried out for an end of the compression-molded piece to form a diameter-reduced section, and then afterward, a sizing core is inserted into the bearing hole of the compression-molded piece so as to eventually form the bearing surface.

Abstract: As it is often difficult for users of a keyboard to adequately identify and select the correct keys in a keyboard where the light is inadequate, it is desirable to provide a keyboard capable that allows a user to better see keys of the keyboard even in environments where there is not sufficient light to see the keys (e.g., in an airplane). A keyboard of the present invention comprises a substrate, a membrane, an elastic member, a cover sheet, a keytop, and light-emitting means for emitting light from the bottom of the substrate to the keytop. The keytop is illuminated and a legend on a key surface can be seen, so that the chance of incorrect key stroke is reduced.

Abstract: A thermal controller and thermal control method for a computer and computer equipped with a thermal controller is disclosed which avoids giving an uncomfortable feeling to the user due to heat generated within a personal computer. A thermal controller for a computer includes a heat pipe for moving heat generated by an MPU within a computer to the vicinity of a top face and a bottom face of a main body, two heat radiating means for releasing heat in the vicinity of the top face and the bottom face, and a volume switch for adjusting a quantity of heat absorbed from a heat spreader by a Peltier device.

Abstract: As it is often difficult for users of a keyboard to adequately identify and select the correct keys in a keyboard where the light is inadequate, it is desirable to provide a keyboard capable that allows a user to better see keys of the keyboard even in environments where there is not sufficient light to see the keys (e.g., in an airplane). A keyboard of the present invention comprises a substrate, a membrane, an elastic member, a cover sheet, a keytop, and light-emitting means for emitting light from the bottom of the substrate to the keytop. The keytop is illuminated and a legend on a key surface can be seen, so that the chance of incorrect key stroke is reduced.

Abstract: A cooling device has a heat sink for transferring a portion of heat generated by a heat generating component to a position different from the position of the heat generating component by heat conduction, a heat pipe for forcibly transferring at least a portion of the rest of the heat generated by the heat generating component to a position different from the position of the heat generating composition, and a forced-heat-radiating means for forcibly radiating the transferred heat from the heat radiating means.

Abstract: An air conditioning system and an air conditioning method are disclosed for quickly and effectively controlling the temperature in a room requiring cooling and keeping the room at a uniform temperature. The present invention estimates a temperature distribution in a room through a simulation and controls airflow rates and airflow directions of a plurality of fans on the basis of the simulation result. Temperature sensors are arranged at predetermined positions in a room such as a computer room. A simulation is performed on the basis of temperatures detected by the temperature sensor Sn and the current airflow rates and airflow directions of a plurality of fans to obtain a temperature distribution in the room. It is determined whether obtained temperatures are in a predetermined temperature range. As the result of such determination, at least one of airflow rate and airflow direction of a fan which covers a position being at a temperature out of the predetermined temperature range is controlled.

Abstract: A method (and structure) for cooling a portable computer includes attaching a portable computer to a holder, transferring heat of a heat-generating component disposed within the portable computer to the holder, and releasing the transferred heat to the atmosphere. The portable computer includes a fixture for detachably fixing the portable computer to the holder, a heat release device for releasing heat of a heat-generating component disposed within the portable computer to the outside, and a supporter which supports the fixture and the heat release device.

Abstract: This invention relates to a composition for metabolic bone diseaese and/or bone fractures which comprises a pharmaceutically acceptable carrier and human neurotrophin-3 (NT-3).This invention also relates to a method for the treatment and/or prevention of metabolic bone diseaese or bone fractures which comprises administering to a patient in need of said treatment and/or prevention a medicament containing an effective amount of human neurotrophin-3 (NT-3).

Abstract: To prevent solder bridges that will easily occur in soldering an element whose leads are narrow in spacing. In a solder resist, there is provided an excess-solder absorbing region in which solder resist is not provided, between an end of a solder pad and the distal end of a lead. When a great deal of solder paste is applied to the solder pad for soldering the lead, an excess of solder melted due to the heat of a heater, flows along the lead and into the excess-solder absorbing region toward the distal end of the lead. Since the excess of solder does not flow across the solder resist provided between the leads, no solder bridge is formed.

Abstract: A vibration driven motor of a construction in which the hardness of the sliding surface of a vibration member is lower than the hardness of the sliding contact portion of a member brought into pressure contact therewith, and the lateral width of the sliding contact portion of the vibration member is smaller than the width of the sliding contact portion of the member brought into pressure contact therewith, whereby the sliding member of the vibration member is caused to wear more than the sliding member of the member brought into pressure contact therewith, thereby to facilitate the discharge of the wear powder thereof and to eliminate the level difference wear of the movable member attributable to the comb-shaped projections and the deterioration of the planarity of the movable member similar thereto.

Abstract: A vibration driven motor including a vibration member for generating a vibration therein, a rotor arranged in frictional contact with the vibration member and driven by the vibration, a rotary output member, and a connection member connecting the rotor to the output member. The connection member includes a bent portion that is deformed in an axial direction on the rotary output member. In another aspect a connection member having a bent portion may be provided for engaging the vibration member at a predetermined portion. In each case, the bent portion(s) of the connection member absorbs any change in the dimensions thereof, e.g., due to a change in the temperature or other environmental factors.

Abstract: A top entry ball valve is proposed which has a valve body formed with a valve chamber, a valve mounted in the valve chamber, a seat ring at the low-pressure side, and a seat ring assembly having another seat ring, a belleville spring and a seat ring holder at the high-pressure side. The seat ring assembly can be easily mounted into and removed out of the valve chamber by use of a clamp while comprising the belleville spring. The clamp comprises a pair of clamping pieces fastened together with a bolt.