Abstract: The invention provides a mounting method by which a flat coil formed by winding an insulator layer and a metal foil sheet in layers can be mounted readily and with certainty on a circuit board. In mounting a flat coil on a circuit board, at first a pair of terminal portions each composed of a layer of solder are formed at a first end portion and a last end portion of the flat coil such that they extend in an axial direction of the coil, and then the coil is disposed on the circuit board such that the terminal portions thereof may be opposed in a perpendicular relationship to connecting faces of a conductor pattern on the circuit board. After then, the coil and the circuit board are heat processed to cause solder material applied to the connecting portions of the conductor pattern to adhere to faces of the terminal portions over the full extent of the axial length of the flat coil to interconnect the connecting faces of the conductor pattern and the terminal portions of the flat coil.