Patents by Inventor Tohru TOCHIHARA

Tohru TOCHIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240391706
    Abstract: A substrate transfer arm includes: a support including an upper surface that faces a substrate and is configured to support the substrate, and a conductive surface that is connected to a ground portion having a ground potential; a conductive pad provided on the upper surface of the support, and configured to support the substrate in contact with a lower surface of the substrate in such a way that the substrate is not brought into contact with the support; and a conductive portion configured to connect the conductive pad and the surface of the support. The conductive portion is located below the upper surface of the conductive pad contacting the substrate and is connected to the conductive pad.
    Type: Application
    Filed: August 7, 2024
    Publication date: November 28, 2024
    Inventors: Hitoshi HASHIMA, Tohru TOCHIHARA, Michiaki MATSUSHITA, Hidekazu KIYAMA
  • Patent number: 12077392
    Abstract: A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: September 3, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hitoshi Hashima, Tohru Tochihara, Michiaki Matsushita, Hidekazu Kiyama
  • Publication number: 20210347584
    Abstract: A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.
    Type: Application
    Filed: May 10, 2021
    Publication date: November 11, 2021
    Inventors: Hitoshi HASHIMA, Tohru TOCHIHARA, Michiaki MATSUSHITA, Hidekazu KIYAMA