Patents by Inventor Tohru Yamakami

Tohru Yamakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7695289
    Abstract: A connector includes a housing and a contact. The contact includes a first part including a first terminal part and a first connection part; a second part including a second terminal part and a second connection part, and a third part including an elastic part having a first end and a second end connected to the first part and the second part, respectively. The first connection part and the second connection part face each other across a gap. The second terminal part is configured to come into press contact with an electrode in response to fixation of the housing to a board. The third part is configured to elastically deform in response to attachment of a plug to the housing and/or the fixation of the housing to the board, so as to cause the first connection part and the second connection part to come into contact and be electrically connected.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: April 13, 2010
    Assignee: Fujitsu Component Limited
    Inventors: Koki Sato, Hideo Miyazawa, Tohru Yamakami, Kazuhiro Mizukami
  • Publication number: 20100015856
    Abstract: A balanced transmission connector includes an insulation block including a contact connecting part for connecting with another connector at a front part of the insulation block and connecting with a substrate at a bottom part of the insulation block, a first signal contact including an upper contact portion projecting from the front of the insulation block and a first lead portion projecting from the rear of the insulation block and extending toward the substrate, a second signal contact including a lower contact portion projecting from the front of the insulation block and a second lead portion projecting from the rear of the insulation block and extending toward the substrate, retaining portions formed on a rear part of the insulation block retaining the first and second lead portions from both sides. The first and second lead portions extend substantially in parallel while maintaining a shortest distance with respect to the substrate.
    Type: Application
    Filed: July 14, 2009
    Publication date: January 21, 2010
    Inventor: Tohru Yamakami
  • Patent number: 7567087
    Abstract: An evaluation board having an interconnection line pattern formed thereon is disclosed. The interconnection line pattern has a first end to be connected to a cable assembly and a second end to be connected to a measurement device measuring the transmission characteristic of the cable assembly. The evaluation board includes an equalizer circuit equalizing the transmission characteristic of the cable assembly.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: July 28, 2009
    Assignee: Fujitsu Component Limited
    Inventors: Tohru Yamakami, Takahiro Kondou
  • Publication number: 20090145653
    Abstract: A substrate pad structure for connecting a lead connecting portion of an electronic device to a substrate is disclosed. The substrate pad structure includes a first pad portion and a second pad portion that are arranged on the substrate at corresponding positions of two end regions of the lead connecting portion, which has a continuous oblong shape. A space portion is provided between the first pad portion and the second pad portion, and the lead connecting portion includes a non-connected region located at a corresponding position of the space portion.
    Type: Application
    Filed: April 18, 2008
    Publication date: June 11, 2009
    Inventors: Tohru Yamakami, Osamu Daikuhara
  • Patent number: 7470139
    Abstract: A transceiver module for mounting to an information processing apparatus is disclosed. The transceiver module includes a housing including a cover part provided at a front side of the transceiver module, a data transmission/reception part mounted to the housing, the data transmission/reception part, a connector installed in the cover part of the housing, and a latch mechanism including an engagement pawl part engaged with the housing, the engagement pawl part including a first cam part, a spring member urging from the housing and abutting the engagement pawl part in a first width direction of the transceiver module, and a pull sleeve having a second cam part for pressing against the first cam part when the pull sleeve is pulled in a longitudinal direction of the transceiver module.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: December 30, 2008
    Assignee: Fujitsu Component Limited
    Inventors: Yasuyuki Miki, Osamu Daikuhara, Yasuhiko Furuno, Hideo Miyazawa, Koichi Kiryu, Tohru Yamakami, Shigeyuki Takizawa, Toshihiro Kusagaya
  • Patent number: 7341471
    Abstract: A disclosed transceiver module includes: a body portion; a connector for external connection disposed at an end of the body portion, where a cable connector is connected thereto while the transceiver module is attached; and a pull sleeve disposed so as to surround the connector for external connection, where when the pull sleeve is pulled, a latch is released and the transceiver module is pulled out from an attached status while the cable connector is detached, wherein the pull sleeve includes a pinch portion for configured to be pinched by fingers within a thickness range thereof.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: March 11, 2008
    Assignee: Fujitsu Component Limited
    Inventor: Tohru Yamakami
  • Patent number: 7297028
    Abstract: A cable connector type transceiver module is disclosed. Pads for wire soldering are disposed near a card edge connecting section of the tip of a printed circuit board on the printed circuit board. Pairs of wires of a cable for balanced transmission are extended in the direction of the card edge connecting section over a control IC package. Signal wires at the tips of insulation covered signal wires of the pairs of wires are soldered to the pads for wire soldering at the position near the card edge connecting section rather than near the control IC package.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: November 20, 2007
    Assignee: Fujitsu Component Limited
    Inventors: Osamu Daikuhara, Koichi Kiryu, Toshihiro Kusagaya, Tohru Yamakami, Shigeyuki Takizawa, Yasuyuki Miki
  • Publication number: 20070232146
    Abstract: A disclosed transceiver module includes: a body portion; a connector for external connection disposed at an end of the body portion, where a cable connector is connected thereto while the transceiver module is attached; and a pull sleeve disposed so as to surround the connector for external connection, where when the pull sleeve is pulled, a latch is released and the transceiver module is pulled out from an attached status while the cable connector is detached, wherein the pull sleeve includes a pinch portion for configured to be pinched by fingers within a thickness range thereof.
    Type: Application
    Filed: October 13, 2006
    Publication date: October 4, 2007
    Applicant: FUJITSU COMPONENT LIMITED
    Inventor: Tohru Yamakami
  • Patent number: 7275962
    Abstract: A disclosed connector includes a resin package unit assembly made of a combination of a resin package unit and an insulator block inside a shield cover assembly. The resin package unit includes a resin package portion, an element having an equalizer function inside the resin package portion, plural leads for contact protruding from the resin package portion and forming contacts, and plural leads for electrical wire connection protruding from the resin package portion, the plural leads for electrical wire connection being connected to an electrical wire. The insulator block has a groove portion for accepting the leads for contact. The resin package unit and the insulator block are combined with each other while the leads for contact are fitted into the groove portion, and a portion of the leads for contact fitted into the groove portion in the insulator block forms a fit connection unit.
    Type: Grant
    Filed: February 1, 2007
    Date of Patent: October 2, 2007
    Assignee: Fujitsu Component Limited
    Inventors: Tohru Yamakami, Osamu Daikuhara
  • Publication number: 20070140643
    Abstract: A cable connector type transceiver module is disclosed. Pads for wire soldering are disposed near a card edge connecting section of the tip of a printed circuit board on the printed circuit board. Pairs of wires of a cable for balanced transmission are extended in the direction of the card edge connecting section over a control IC package. Signal wires at the tips of insulation covered signal wires of the pairs of wires are soldered to the pads for wire soldering at the position near the card edge connecting section rather than near the control IC package.
    Type: Application
    Filed: July 20, 2006
    Publication date: June 21, 2007
    Applicant: FUJITSU COMPONENT LIMITED
    Inventors: Osamu Daikuhara, Koichi Kiryu, Toshihiro Kusagaya, Tohru Yamakami, Shigeyuki Takizawa, Yasuyuki Miki
  • Publication number: 20060166525
    Abstract: An evaluation board having an interconnection line pattern formed thereon is disclosed. The interconnection line pattern has a first end to be connected to a cable assembly and a second end to be connected to a measurement device measuring the transmission characteristic of the cable assembly. The evaluation board includes an equalizer circuit equalizing the transmission characteristic of the cable assembly.
    Type: Application
    Filed: August 16, 2005
    Publication date: July 27, 2006
    Applicant: FUJITSU COMPONENT LIMITED
    Inventors: Tohru Yamakami, Takahiro Kondou
  • Publication number: 20060116084
    Abstract: A transceiver module for mounting to an information processing apparatus is disclosed. The transceiver module includes a housing including a cover part provided at a front side of the transceiver module, a data transmission/reception part mounted to the housing, the data transmission/reception part, a connector installed in the cover part of the housing, and a latch mechanism including an engagement pawl part engaged with the housing, the engagement pawl part including a first cam part, a spring member urging from the housing and abutting the engagement pawl part in a first width direction of the transceiver module, and a pull sleeve having a second cam part for pressing against the first cam part when the pull sleeve is pulled in a longitudinal direction of the transceiver module.
    Type: Application
    Filed: July 27, 2005
    Publication date: June 1, 2006
    Applicant: FUJITSU COMPONENT LIMITED
    Inventors: Yasuyuki Miki, Osamu Daikuhara, Yasuhiko Furuno, Hideo Miyazawa, Koichi Kiryu, Tohru Yamakami, Shigeyuki Takizawa, Toshihiro Kusagaya