Patents by Inventor Tokihiro Terashima

Tokihiro Terashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7905666
    Abstract: An optical module includes a first silicon substrate having a first groove at its surface, a second silicon substrate having a second groove at its surface, a Laser device formed on the first silicon substrate, an optical modulator formed on the second silicon substrate, a substrate on which the first and the second silicon substrates are mounted wherein an optical axis of the Laser device is matched up with an optical axis of the optical modulator, a first lens transforming an divergent light emitted from the first optical device into a parallel light, disposed in the first groove, and a second lens converging the parallel light to the second optical device, disposed in the first groove.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: March 15, 2011
    Assignee: Oki Semiconductor Co., Ltd.
    Inventors: Tokihiro Terashima, Hiroshi Wada
  • Publication number: 20090220185
    Abstract: The present invention provides an MZ light modulator that can be operated with both of a negative chirp characteristic and a zero chirp characteristic by a single device. The MZ light modulator has first and second waveguides that respectively waveguide two branched lights equal in intensity and perform optical phase modulation by application of first and second modulation voltage signals. Core layers to which modulating electric fields of the first and second waveguides are applied, are different in thickness from each other. The first and second modulation voltage signals are push-pull signals opposite in phase to each other and are different in center voltage from each other.
    Type: Application
    Filed: February 17, 2009
    Publication date: September 3, 2009
    Applicant: OKI SEMICONDUCTOR CO., LTD.
    Inventors: Hiroshi Wada, Tokihiro Terashima
  • Publication number: 20080285110
    Abstract: An optical module includes a first silicon substrate having a first groove at its surface, a second silicon substrate having a second groove at its surface, a Laser device formed on the first silicon substrate, an optical modulator formed on the second silicon substrate, a substrate on which the first and the second silicon substrates are mounted wherein an optical axis of the Laser device is matched up with an optical axis of the optical modulator, a first lens transforming an divergent light emitted from the first optical device into a parallel light, disposed in the first groove, and a second lens converging the parallel light to the second optical device, disposed in the first groove.
    Type: Application
    Filed: February 6, 2008
    Publication date: November 20, 2008
    Inventors: Tokihiro Terashima, Hiroshi Wada
  • Patent number: 7433550
    Abstract: A Mach-Zehnder optical modulator capable of feed-back compensating a change due to an optical coupling loss, and the characteristic change peculiar to functional devices, and a control method therefore, are provided. A control method for a semiconductor Mach-Zehnder optical modulator using a laser device as a light source includes modulating light emitted from the laser device, and extracting the light as output light; detecting monitor light separate from the output light, among the optically modulated light; and feed-back controlling an optical output intensity of the laser device based on the monitor light.
    Type: Grant
    Filed: April 10, 2006
    Date of Patent: October 7, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Tokihiro Terashima, Hiroshi Wada
  • Patent number: 7419311
    Abstract: A surface mount optical coupler includes a silicon substrate; an optical semiconductor device disposed on an upper surface of the silicon substrate; and a short bare fiber formed of vitreous silica. A V-shaped linear groove is formed in the upper surface of the silicon substrate. The V-shaped groove extends from one end surface of the silicon substrate toward a light emitting surface of the optical semiconductor device in a direction perpendicular to the light emitting surface. Further, the V-shape groove supports the short bare fiber. The short bare fiber has one end surface optically coupled with a light emitting portion of the light emitting surface. The short bare fiber has a length smaller than that of the V-shaped groove.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: September 2, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Tokihiro Terashima, Hiroshi Wada
  • Publication number: 20070248301
    Abstract: A surface mount optical coupler includes a silicon substrate; an optical semiconductor device disposed on an upper surface of the silicon substrate; and a short bare fiber formed of vitreous silica. A V-shaped linear groove is formed in the upper surface of the silicon substrate. The V-shaped groove extends from one end surface of the silicon substrate toward a light emitting surface of the optical semiconductor device in a direction perpendicular to the light emitting surface. Further, the V-shape groove supports the short bare fiber. The short bare fiber has one end surface optically coupled with a light emitting portion of the light emitting surface. The short bare fiber has a length smaller than that of the V-shaped groove.
    Type: Application
    Filed: February 8, 2007
    Publication date: October 25, 2007
    Inventors: Tokihiro Terashima, Hiroshi Wada
  • Publication number: 20070081756
    Abstract: In order to provide a Mach-Zehnder optical modulator capable of feed-back compensating a change due to an optical coupling loss, and the characteristic change peculiar to functional devices, and a control method therefor, a control method for a semiconductor Mach-Zehnder optical modulator using a laser device as a light source according to the present invention includes: a step for modulating light emitted from the laser device, and extracting the light as output light; a step for detecting monitor light separate from the output light, among the optically modulated light; and a step for feed-back controlling an optical output intensity of the laser device based on the monitor light.
    Type: Application
    Filed: April 10, 2006
    Publication date: April 12, 2007
    Inventors: Tokihiro Terashima, Hiroshi Wada
  • Patent number: 7046868
    Abstract: A planar-mounted optical waveguide transmitter-receiver module has a plurality of separated silicon substrates and a PLC substrate hybrid-integrated. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and an adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of the optical waveguide (PLC) substrate, in which is formed an optical waveguide.
    Type: Grant
    Filed: August 13, 2002
    Date of Patent: May 16, 2006
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Tokihiro Terashima
  • Publication number: 20030007754
    Abstract: A planar-mounted optical waveguide transmitter-receiver module, in which a plurality of separated silicon substrates and a PLC substrate are hybrid-integrated, is provided. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of an optical waveguide (PLC) substrate, in which is formed an optical waveguide.
    Type: Application
    Filed: August 13, 2002
    Publication date: January 9, 2003
    Inventor: Tokihiro Terashima
  • Patent number: 6456767
    Abstract: A planar-mounted optical waveguide transmitter-receiver module, in which a plurality of separated silicon substrates and a PLC substrate are hybrid-integrated, is provided. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of an optical waveguide (PLC) substrate, in which is formed an optical waveguide.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: September 24, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Tokihiro Terashima
  • Publication number: 20010028768
    Abstract: A planar-mounted optical waveguide transmitter-receiver module, in which a plurality of separated silicon substrates and a PLC substrate are hybrid-integrated, is provided. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of an optical waveguide (PLC) substrate, in which is formed an optical waveguide.
    Type: Application
    Filed: March 28, 2001
    Publication date: October 11, 2001
    Inventor: Tokihiro Terashima