Patents by Inventor Tokihiro Terashima
Tokihiro Terashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7905666Abstract: An optical module includes a first silicon substrate having a first groove at its surface, a second silicon substrate having a second groove at its surface, a Laser device formed on the first silicon substrate, an optical modulator formed on the second silicon substrate, a substrate on which the first and the second silicon substrates are mounted wherein an optical axis of the Laser device is matched up with an optical axis of the optical modulator, a first lens transforming an divergent light emitted from the first optical device into a parallel light, disposed in the first groove, and a second lens converging the parallel light to the second optical device, disposed in the first groove.Type: GrantFiled: February 6, 2008Date of Patent: March 15, 2011Assignee: Oki Semiconductor Co., Ltd.Inventors: Tokihiro Terashima, Hiroshi Wada
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Publication number: 20090220185Abstract: The present invention provides an MZ light modulator that can be operated with both of a negative chirp characteristic and a zero chirp characteristic by a single device. The MZ light modulator has first and second waveguides that respectively waveguide two branched lights equal in intensity and perform optical phase modulation by application of first and second modulation voltage signals. Core layers to which modulating electric fields of the first and second waveguides are applied, are different in thickness from each other. The first and second modulation voltage signals are push-pull signals opposite in phase to each other and are different in center voltage from each other.Type: ApplicationFiled: February 17, 2009Publication date: September 3, 2009Applicant: OKI SEMICONDUCTOR CO., LTD.Inventors: Hiroshi Wada, Tokihiro Terashima
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Publication number: 20080285110Abstract: An optical module includes a first silicon substrate having a first groove at its surface, a second silicon substrate having a second groove at its surface, a Laser device formed on the first silicon substrate, an optical modulator formed on the second silicon substrate, a substrate on which the first and the second silicon substrates are mounted wherein an optical axis of the Laser device is matched up with an optical axis of the optical modulator, a first lens transforming an divergent light emitted from the first optical device into a parallel light, disposed in the first groove, and a second lens converging the parallel light to the second optical device, disposed in the first groove.Type: ApplicationFiled: February 6, 2008Publication date: November 20, 2008Inventors: Tokihiro Terashima, Hiroshi Wada
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Patent number: 7433550Abstract: A Mach-Zehnder optical modulator capable of feed-back compensating a change due to an optical coupling loss, and the characteristic change peculiar to functional devices, and a control method therefore, are provided. A control method for a semiconductor Mach-Zehnder optical modulator using a laser device as a light source includes modulating light emitted from the laser device, and extracting the light as output light; detecting monitor light separate from the output light, among the optically modulated light; and feed-back controlling an optical output intensity of the laser device based on the monitor light.Type: GrantFiled: April 10, 2006Date of Patent: October 7, 2008Assignee: Oki Electric Industry Co., Ltd.Inventors: Tokihiro Terashima, Hiroshi Wada
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Patent number: 7419311Abstract: A surface mount optical coupler includes a silicon substrate; an optical semiconductor device disposed on an upper surface of the silicon substrate; and a short bare fiber formed of vitreous silica. A V-shaped linear groove is formed in the upper surface of the silicon substrate. The V-shaped groove extends from one end surface of the silicon substrate toward a light emitting surface of the optical semiconductor device in a direction perpendicular to the light emitting surface. Further, the V-shape groove supports the short bare fiber. The short bare fiber has one end surface optically coupled with a light emitting portion of the light emitting surface. The short bare fiber has a length smaller than that of the V-shaped groove.Type: GrantFiled: February 8, 2007Date of Patent: September 2, 2008Assignee: Oki Electric Industry Co., Ltd.Inventors: Tokihiro Terashima, Hiroshi Wada
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Publication number: 20070248301Abstract: A surface mount optical coupler includes a silicon substrate; an optical semiconductor device disposed on an upper surface of the silicon substrate; and a short bare fiber formed of vitreous silica. A V-shaped linear groove is formed in the upper surface of the silicon substrate. The V-shaped groove extends from one end surface of the silicon substrate toward a light emitting surface of the optical semiconductor device in a direction perpendicular to the light emitting surface. Further, the V-shape groove supports the short bare fiber. The short bare fiber has one end surface optically coupled with a light emitting portion of the light emitting surface. The short bare fiber has a length smaller than that of the V-shaped groove.Type: ApplicationFiled: February 8, 2007Publication date: October 25, 2007Inventors: Tokihiro Terashima, Hiroshi Wada
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Publication number: 20070081756Abstract: In order to provide a Mach-Zehnder optical modulator capable of feed-back compensating a change due to an optical coupling loss, and the characteristic change peculiar to functional devices, and a control method therefor, a control method for a semiconductor Mach-Zehnder optical modulator using a laser device as a light source according to the present invention includes: a step for modulating light emitted from the laser device, and extracting the light as output light; a step for detecting monitor light separate from the output light, among the optically modulated light; and a step for feed-back controlling an optical output intensity of the laser device based on the monitor light.Type: ApplicationFiled: April 10, 2006Publication date: April 12, 2007Inventors: Tokihiro Terashima, Hiroshi Wada
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Patent number: 7046868Abstract: A planar-mounted optical waveguide transmitter-receiver module has a plurality of separated silicon substrates and a PLC substrate hybrid-integrated. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and an adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of the optical waveguide (PLC) substrate, in which is formed an optical waveguide.Type: GrantFiled: August 13, 2002Date of Patent: May 16, 2006Assignee: Oki Electric Industry Co., Ltd.Inventor: Tokihiro Terashima
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Publication number: 20030007754Abstract: A planar-mounted optical waveguide transmitter-receiver module, in which a plurality of separated silicon substrates and a PLC substrate are hybrid-integrated, is provided. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of an optical waveguide (PLC) substrate, in which is formed an optical waveguide.Type: ApplicationFiled: August 13, 2002Publication date: January 9, 2003Inventor: Tokihiro Terashima
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Patent number: 6456767Abstract: A planar-mounted optical waveguide transmitter-receiver module, in which a plurality of separated silicon substrates and a PLC substrate are hybrid-integrated, is provided. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of an optical waveguide (PLC) substrate, in which is formed an optical waveguide.Type: GrantFiled: March 28, 2001Date of Patent: September 24, 2002Assignee: Oki Electric Industry Co., Ltd.Inventor: Tokihiro Terashima
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Publication number: 20010028768Abstract: A planar-mounted optical waveguide transmitter-receiver module, in which a plurality of separated silicon substrates and a PLC substrate are hybrid-integrated, is provided. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of an optical waveguide (PLC) substrate, in which is formed an optical waveguide.Type: ApplicationFiled: March 28, 2001Publication date: October 11, 2001Inventor: Tokihiro Terashima