Patents by Inventor Tokihiro Yokoshima

Tokihiro Yokoshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE, METHOD OF FORMING FINE GOLD STRUCTURE USING SAME, AND FINE GOLD STRUCTURE FORMED USING SAME
    Publication number: 20120119352
    Abstract: An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 ?m or smaller, in terms of the width of the exposed substrate area, and having a height of 3 ?m or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 ?m or finer is formed therefrom.
    Type: Application
    Filed: March 10, 2010
    Publication date: May 17, 2012
    Applicant: Kanto Kagaku Kabushiki Kaisha
    Inventors: Ryota Iwai, Tomoaki Tokuhisa, Masaru Kato, Tokihiro Yokoshima, Masahiro Aoyagi, Yasuhiro Yamaji, Katsuya Kikuchi, Hiroshi Nakagawa