Patents by Inventor Tokihito Osaki

Tokihito Osaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6998089
    Abstract: A molding tool and a method of fabrication thereof which can reduce the fabrication period remarkably, are disclosed. In particular, a molding tool and a method of fabrication thereof which are most suitable for producing a small lot of plastic molded objects used for preparing prototype parts or the like are proposed. Thin die surface layers (20, 30) each having a predetermined die surface shape (C1, C2) are formed by a stereolithography method using a stereolithography material or a powder sinter molding method using a powder molding material. Reinforcing rib portions (25, 35) are formed integrally with the thin die surface layers by the stereolithography method or the powder sinter molding method on the back surface of the thin die surface layers, respectively. Back reinforcement resin layers (26, 36) are filled integrally in the space of the reinforcing rib portions on the back surface of the thin die surface layers.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: February 14, 2006
    Assignee: Kabushiki Kaisha Tokai Model
    Inventor: Tokihito Osaki
  • Publication number: 20030011106
    Abstract: A molding tool and a method of fabrication thereof which can reduce the fabrication period remarkably, are disclosed. In particular, a molding tool and a method of fabrication thereof which are most suitable for producing a small lot of plastic molded objects used for preparing prototype parts or the like are proposed. Thin die surface layers (20, 30) each having a predetermined die surface shape (C1, C2) are formed by a stereolithography method using a stereolithography material or a powder sinter molding method using a powder molding material. Reinforcing rib portions (25, 35) are formed integrally with the thin die surface layers by the stereolithography method or the powder sinter molding method on the back surface of the thin die surface layers, respectively. Back reinforcement resin layers (26, 36) are filled integrally in the space of the reinforcing rib portions on the back surface of the thin die surface layers.
    Type: Application
    Filed: June 24, 2002
    Publication date: January 16, 2003
    Inventor: Tokihito Osaki