Abstract: To provide a research information management system that contributes to support activities for researchers such that research results of the researchers all over the world are fairly evaluated and an incentive can be received. The present invention is that a first terminal of a researcher, a second terminal of a research supporter, and a third terminal of a general participant access a server of a platform having the server and a database through a network.

Abstract: The purpose of the present invention is to provide a micro-needle having a leading end that can reach the dermis with certainty by penetrating through the epidermis when piercing the skin and that can supply a drug or the like to the dermis or to a region deeper than the dermis. Accordingly, this micro-needle (10) has a base (1) and a plate-shaped blade (2). The plate-shaped blade (2) and the base (1) are formed in an integrated manner, and the plateshaped blade (2) extends from an end (1A: step section) of the base (1). Alternatively, the present invention is characterized by having a base (111) and a conical leading end part (112) and a star-like polygonal cross-sectional shape part (114, 124) being formed in a region between the base (111) and the conical leading end part (112), and in that the base (111), the conical leading end part (112) and the starlike polygonal cross-sectional shape part (114, 124) are formed in an integrated manner.

Abstract: A chemical mechanical polishing apparatus in which a rotating head having a polishing pad mounted thereon whose contact area with a polishing object is smaller than surface area of the polishing object is pressed against and brought into contact with a surface of the polishing object mounted face up on a table, and is rotated with the table at rest while supplying slurry onto a contact surface to polish for a predetermined time, and then the rotating head is moved within the surface of the polishing object to polish the entire surface of the polishing object sequentially, including a pressure adjustment mechanism for maintaining a pressing load on the contact surface constant during polishing.

Abstract: Provided is a method for manufacturing a coil element, capable of manufacturing a coil element using a resin mold and without performing releasing and transferring, and capable of thinning the coil element. A method for manufacturing a coil element using a resin mold that is soluble in organic solvent, includes, preparing a resin mold, on a surface of which an inverted coil element pattern is engraved, forming a metal seed film on the surface of the resin mold, removing the metal seed film in an area where the inverted coil element pattern is not formed, forming a center conductive film so as to fill an area where the inverted coil element pattern is engraved by first electroplating while using the metal seed film as a base, and dissolving the resin mold to take out the center conductive film.

Abstract: A method for producing a coil element includes preparing a transfer mold having an inverse coil element pattern etched thereon, forming a peel-away film and an insulating film on the surface of the transfer mold in a superimposed manner, forming a resist film in an area having no inverse coil element pattern formed therein on the insulating film, removing by etching the insulating film with the resist film as a mask, after removing the resist film, filling up an area having the inverse coil element pattern formed therein and forming a central conductive film by first electroplating so as to slightly protrude above the insulating film, peeling the central conductive film from the transfer mold, and forming a surface conductive film by second electroplating with the central conductive film as a foundation and forming a coil element comprised of the central conductive film and the surface conductive film.

Abstract: A method for manufacturing a coil element including forming a groove in a substrate surface of a resin substrate, forming a metallic coating, forming a resist pattern being a reverse pattern of a coil element pattern on the surface to sandwich the groove, so as to have a thickness, forming a central conductive film of the coil element on the surface including the groove, by electroforming with the resist pattern as a mask, so as to have a height equal to or less than the thickness, removing the resist pattern and the exposed metallic coating forming a surface conductive film by electroforming with the central conductive film as a foundation, to form a coil element made of the central conductive film and surface conductive film, peeling away the coil element from the substrate, and removing a portion formed in the groove, of the central conductive film by reverse electrolytic etching.

Abstract: A method for manufacturing a coil element using a transferring mold, includes preparing the mold, on a surface of which an inverted coil element pattern is engraved, the mold having at least a surface part made of metal, forming a center conductive film by electroplating at the mold as a whole so as to have a thickness exceeding a thickness of an area where the pattern is engraved, removing the film from a surface by a predetermined thickness to flatten the surface of the center conductive film, releasing the flattened center conductive film from the mold, coating a protective film at a surface as a whole of the released film on a side where the pattern is formed, etching the film for removal from the side subjected to the flattening so that the side reaches the protective film, and removing the protective film and taking out the center conductive film.

Abstract: A spray coater having a nozzle for spraying a coating liquid, a heater, a slider mounting the nozzle and the heater, and capable of moving reciprocatorily in perpendicular two directions, and a substrate holder holding a substrate so that the surface faces downward with respect to the nozzle, the spray coater forming a thick film by spraying and applying the coating liquid to the surface of the substrate by the nozzle and then heating and drying the coating liquid by the heater, wherein an application of the coating liquid is carried out sequentially by a spray area, and the nozzle and the heater are arranged in parallel so that the drying to the spray area to which the application has been performed is carried out immediately after the application, thereby forming a flat thick film even on a large-sized substrate.

Abstract: A multi-stage transfer mold manufacturing method that can save labor in a step of connecting by a multi-stage connection, a multi-stage transfer mold manufactured thereby, and a component produced thereby are provided for production of a multi-stage component by electroplating. A method therefor includes the steps of forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle, forming, on the resist pattern, a resist pattern having a shape and a thickness of a connection pillar for connecting with an upper layer, creating a transfer mold by filling up the resist pattern on which the resist pattern having the shape of the connection pillar by electroplating to a predetermined thickness, and providing a master mold by separating the transfer mold from the metal substrate.

Abstract: A transfer mold, which has superior durability and high aspect ratio, for production of a component by electroplating and a component produced thereby are provided. A method therefor includes the steps of forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle, creating a transfer mold by filing up the resist pattern having the shape of the component by electroplating to a predetermined thickness and providing a master mold by separating the transfer mold from the metal substrate.

Abstract: A transfer mold that is used in production of a component by electroplating and has high workability and superior durability as well as a component produced thereby are provided. A method therefor includes the steps of forming a pattern of a desired component by providing a reverse pattern of the pattern of the desired component on a metal substrate and etching the metal substrate using the reverse pattern as a mask and treating the reverse pattern with heat or removing the reverse pattern and forming an insulation layer in a portion where the reverse pattern has been removed.