Patents by Inventor Tokio Okoshi

Tokio Okoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package for mounting a semiconductor device
    Patent number: 5665473
    Abstract: A package for mounting a semiconductor device comprises a base plate and a conductive layer laminated onto the base plate via an adhesive layer. The modulus of elasticity at 25.degree. C. of the adhesive layer is 10 kg/mm.sup.2 or less.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: September 9, 1997
    Assignee: Tokuyama Corporation
    Inventors: Tokio Okoshi, Yuka Kato, Hideki Okoshi, Kenichiro Miyahara, Masakatsu Maeda
  • Electrically insulating substrate and a method of making such a substrate
    Patent number: 4370421
    Abstract: From 0.1 to 3.5% by weight of beryllium oxide powder, calculated as beryllium, is added to silicon carbide powder containing up to 0.1% by weight of aluminum, up to 0.1% by weight of boron and up to 0.4% by weight of free carbon, and the mixed powder is pressure-molded. The resulting molded article is heated to a temperature of 1,850.degree. C. to 2,500.degree. C. till there is obtained a sintered body having at least 90% relative density of silicon carbide. Thus, the sintered body having thermal conductivity of at least 0.4 cal/cm.sec..degree. C. at 25.degree. C., electrical resistivity of at least 10.sup.7 Ohm.cm at 25.degree. C. and coefficient of thermal expansion of 3.3.about.4.times.10.sup.-6 /.degree.C. at 25.degree. C. to 300.degree. C. can be obtained.
    Type: Grant
    Filed: November 5, 1980
    Date of Patent: January 25, 1983
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Matsushita, Yukio Takeda, Kousuke Nakamura, Tokio Okoshi