Patents by Inventor Tokiyoshi TANIGAWA

Tokiyoshi TANIGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rotary electric machine having heat sink for semiconductor device of controller
    Patent number: 11025140
    Abstract: In a rotary electric machine in which a controller and a heat sink are arranged in an extending direction of an output shaft of a motor, in order to provide a rotary electric machine which secures a heat rejection performance and an insulation performance of a semiconductor device to be mounted to the controller and is downsized as a whole, the controller includes a semiconductor device having a drive circuit provided so as to correspond to a stator winding of the motor, and the semiconductor device has a main face held in close contact with the heat sink. On a close contact face between the semiconductor device and the heat sink, a drive circuit is formed so as to extend along an outer edge portion of the heat sink to increase a cooling area.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: June 1, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takanobu Kajihara, Katsuhiko Omae, Shunsuke Fushie, Tokiyoshi Tanigawa, Hiroyuki Miyanishi, Atsuki Fujita, Tomohiro Inoue, Yuki Okabe, Junya Suzuki
  • ROTARY ELECTRIC MACHINE
    Publication number: 20190372432
    Abstract: In a rotary electric machine in which a controller and a heat sink are arranged in an extending direction of an output shaft of a motor, in order to provide a rotary electric machine which secures a heat rejection performance and an insulation performance of a semiconductor device to be mounted to the controller and is downsized as a whole, the controller includes a semiconductor device having a drive circuit provided so as to correspond to a stator winding of the motor, and the semiconductor device has a main face held in close contact with the heat sink. On a close contact face between the semiconductor device and the heat sink, a drive circuit is formed so as to extend along an outer edge portion of the heat sink to increase a cooling area.
    Type: Application
    Filed: November 22, 2016
    Publication date: December 5, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takanobu KAJIHARA, Katsuhiko OMAE, Shunsuke FUSHIE, Tokiyoshi TANIGAWA, Hiroyuki MIYANISHI, Atsuki FUJITA, Tomohiro INOUE, Yuki OKABE, Junya SUZUKI