Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5–100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130–250° C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.

Abstract: An epoxy-silicone mixed resin composition comprising (A) an organopolysiloxane having at least one vinyl or allyl group and at least one hydroxyl group, (B) an organic resin having at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, (E) an aluminum compound, and (F) 0.1-15% by weight of an organic mold release agent is molded and cured in a metal mold into a transparent product which can be smoothly removed from the mold. The cured product has a satisfactory bond strength to metal frames and maintains heat resistance. LED devices can be fabricated by continuous mechanical molding.

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5-100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130-250° C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.