Patents by Inventor Tokuhiro Uchiyama

Tokuhiro Uchiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame for fabricating surface mount type semiconductor devices with high reliability
    Patent number: 6677666
    Abstract: A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions for mounting semiconductor pellets thereon having first end portions connected to the first band shaped member; coupling strip each provided for one of the island portions whose first end portion connects to a second end portion of each of the island portions and whose second end portion connects to the second band shaped member. The lead frame further comprises at least one electrode portion for each of the island portions and electrically coupled with a corresponding electrode of the semiconductor pellet. The at least one electrode portion is disposed between each of the island portions and the second band shaped member, a first end portion thereof is connected to the second band shaped member, and a second end portion thereof is opposed to the second end portion of each of the island portions.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: January 13, 2004
    Assignee: NEC Electronics Corporation
    Inventors: Yoshiharu Kaneda, Tokuhiro Uchiyama
  • Production system wherein fabrication data are collected using light tower control signals
    Publication number: 20030122679
    Abstract: A production system comprises a plurality of fabrication apparatuses arranged in series for performing a sequential processing of work units applied to the system. All or some of the fabrication apparatuses are respectively equipped with sets of lamps each of which visually indicates fabrication states of the corresponding fabrication apparatus by energizing or de-energizing different colored lamps. A lamp control signal monitor is provided in each fabrication apparatus having the set of lamps. The lamp control signal monitor receives lamp control information used to energize or de-energize the colored lamps, and stores therein data indicative of start and finish time points and time durations of energization and de-energization of the colored lamps.
    Type: Application
    Filed: December 27, 2001
    Publication date: July 3, 2003
    Applicant: NEC CORPORATION
    Inventors: Iwao Matsushima, Junichi Tanaka, Tokuhiro Uchiyama
  • Lead frame for fabricating surface mount type semiconductor devices with high reliability
    Publication number: 20030080396
    Abstract: A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions for mounting semiconductor pellets thereon having first end portions connected to the first band shaped member; coupling strip each provided for one of the island portions whose first end portion connects to a second end portion of each of the island portions and whose second end portion connects to the second band shaped member. The lead frame further comprises at least one electrode portion for each of the island portions and electrically coupled with a corresponding electrode of the semiconductor pellet. The at least one electrode portion is disposed between each of the island portions and the second band shaped member, a first end portion thereof is connected to the second band shaped member, and a second end portion thereof is opposed to the second end portion of each of the island portions.
    Type: Application
    Filed: December 13, 2002
    Publication date: May 1, 2003
    Applicant: NEC CORPORATION
    Inventors: Yoshiharu Kaneda, Tokuhiro Uchiyama
  • Lead frame for fabricating surface mount type semiconductor devices with high reliability
    Patent number: 6507093
    Abstract: A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions for mounting semiconductor pellets thereon having first end portions connected to the first band shaped member; coupling strip each provided for one of the island portions whose first end portion connects to a second end portion of each of the island portions and whose second end portion connects to the second band shaped member. The lead frame further comprises at least one electrode portion for each of the island portions and electrically coupled with a corresponding electrode of the semiconductor pellet. The at least one electrode portion is disposed between each of the island portions and the second band shaped member, a first end portion thereof is connected to the second band shaped member, and a second end portion thereof is opposed to the second end portion of each of the island portions.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: January 14, 2003
    Assignee: NEC Corporation
    Inventors: Yoshiharu Kaneda, Tokuhiro Uchiyama
  • Lead frame for fabricating surface mount type semiconductor devices with high reliability
    Publication number: 20010033008
    Abstract: A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions for mounting semiconductor pellets thereon having first end portions connected to the first band shaped member; coupling strip each provided for one of the island portions whose first end portion connects to a second end portion of each of the island portions and whose second end portion connects to the second band shaped member. The lead frame further comprises at least one electrode portion for each of the island portions and electrically coupled with a corresponding electrode of the semiconductor pellet. The at least one electrode portion is disposed between each of the island portions and the second band shaped member, a first end portion thereof is connected to the second band shaped member, and a second end portion thereof is opposed to the second end portion of each of the island portions.
    Type: Application
    Filed: April 18, 2001
    Publication date: October 25, 2001
    Applicant: NEC CORPORATION
    Inventors: Yoshiharu Kaneda, Tokuhiro Uchiyama