Patents by Inventor Tokuhisa OIWA

Tokuhisa OIWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230013805
    Abstract: A plasma processing apparatus includes a mounting table, an acquisition unit, a calculation unit, and an elevation control unit. The mounting table mounts thereon a target object as a plasma processing target. The elevation mechanism vertically moves a focus ring surrounding the target object. The acquisition unit acquires state information indicating a measured state of the target object. The calculation unit calculates a height of the focus ring at which positional relation between an upper surface of the target object and an upper surface of the focus ring satisfies a predetermined distance based on the state of the target object that is indicated by the state information acquired by the acquisition unit. The elevation control unit controls the elevation mechanism to vertically move the focus ring to the height calculated by the calculation unit.
    Type: Application
    Filed: September 27, 2022
    Publication date: January 19, 2023
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Yusuke SAITOH, Tokuhisa OIWA
  • Publication number: 20190318918
    Abstract: A plasma processing apparatus includes a mounting table on which a target object as a plasma processing target is mounted, a focus ring disposed to surround the target object, and an acquisition unit configured to acquire state information indicating a measured state of the target object. The plasma processing apparatus further includes a plasma control unit configured to control plasma processing based on the state of the target object indicated by the state information acquired by the acquisition unit such that a difference between a height of an interface of a plasma sheath above the target object and a height of an interface of a plasma sheath above the focus ring is within a predetermined range.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 17, 2019
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Yusuke SAITOH, Tokuhisa OIWA
  • Publication number: 20190108986
    Abstract: A plasma processing apparatus includes a mounting table, an acquisition unit, a calculation unit, and an elevation control unit. The mounting table mounts thereon a target object as a plasma processing target. The elevation mechanism vertically moves a focus ring surrounding the target object. The acquisition unit acquires state information indicating a measured state of the target object. The calculation unit calculates a height of the focus ring at which positional relation between an upper surface of the target object and an upper surface of the focus ring satisfies a predetermined distance based on the state of the target object that is indicated by the state information acquired by the acquisition unit. The elevation control unit controls the elevation mechanism to vertically move the focus ring to the height calculated by the calculation unit.
    Type: Application
    Filed: October 10, 2018
    Publication date: April 11, 2019
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Yusuke SAITOH, Tokuhisa OIWA