Patents by Inventor Tokuichi Yamaji

Tokuichi Yamaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230125028
    Abstract: To provide an opportunity to receive advice on equipment that is beneficial for users to improve their skill. A motion analysis system includes a movement sensor device for detecting a state of a racket, a user terminal for presenting to a user an analysis result of a movement of the racket analyzed based on detection information detected by the movement sensor device, and an adviser terminal for presenting to an adviser an advice request transmitted from the user terminal along with the analysis result and receiving input of advice information created by the adviser and corresponding to the advice request. The advice information includes recommendation information related to equipment recommended to the user.
    Type: Application
    Filed: February 25, 2021
    Publication date: April 20, 2023
    Inventors: Munetaka SOEJIMA, Shun TAKANAMI, Tokuichi YAMAJI
  • Patent number: 10444015
    Abstract: A sensor includes a weight body, a frame which is located so as to surround the weight body when viewed from above, a beam part which is provided with flexibility and in which a first end is connected to the weight body and a second end is connected to the frame, and a detection part which is provided on the beam part and detects deformation of the beam part as an electric signal. The beam part includes a main part in which a cross-sectional shape in a direction perpendicular to a longitudinal direction connecting the first end and the second end is a rectangular shape, and an extending part which protrudes from at least one of an upper surface or a lower surface of the main part and extends in the longitudinal direction or extends in a width direction perpendicular to the longitudinal direction when viewed from above.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: October 15, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Masaru Nagata, Tokuichi Yamaji, Shigeo Tanahashi
  • Publication number: 20170003130
    Abstract: A sensor includes a weight body, a frame which is located so as to surround the weight body when viewed from above, a beam part which is provided with flexibility and in which a first end is connected to the weight body and a second end is connected to the frame, and a detection part which is provided on the beam part and detects deformation of the beam part as an electric signal. The beam part includes a main part in which a cross-sectional shape in a direction perpendicular to a longitudinal direction connecting the first end and the second end is a rectangular shape, and an extending part which protrudes from at least one of an upper surface or a lower surface of the main part and extends in the longitudinal direction or extends in a width direction perpendicular to the longitudinal direction when viewed from above.
    Type: Application
    Filed: March 19, 2015
    Publication date: January 5, 2017
    Applicant: KYOCERA Corporation
    Inventors: Masaru NAGATA, Tokuichi YAMAJI, Shigeo TANAHASHI
  • Publication number: 20160341759
    Abstract: A sensor comprising: a mass element; a frame surrounding the mass element; a connecting body having flexibility, and connecting the mass element to the frame; a pressure detecting unit; and an acceleration detecting unit. The mass element comprises: a main portion comprising a through-hole passing therethrough from the top surface to the bottom surface; a mounting portion connected to the top surface of the main portion, and surrounding an outer periphery of the through-hole; a first cover portion having flexibility, connected to the mounting portion and covering the through-hole; and a second cover portion, disposed on the bottom surface of the main portion, covering the through-hole, and deformable less than the first cover portion when received an external force.
    Type: Application
    Filed: January 26, 2015
    Publication date: November 24, 2016
    Inventors: Tokuichi YAMAJI, Yuko YOKOTA, Atsuo HATATE, Hiroki ISHIKAWA, Takeshi SUZUKI, Hideaki ASAO
  • Patent number: 6694069
    Abstract: An object of the invention is to provide an optical integrated circuit substrate capable of establishing optical connection between an optical waveguide and a semiconductor light-receiving element with high light-receiving efficiency and of achieving low-loss light transmission. In the optical integrated circuit substrate, on a substrate is formed an optical waveguide having a clad and a core layer. Embedded in the optical waveguide are a metal placement portion for an optical element and a thin-film optical element placed thereon. Distance between the thin-film optical element and the core layer is reduced. In a region free of the thin-film optical element, there is an adequate distance between the core layer and the substrate. This allows satisfactory optical connection between the thin-film optical element and the optical waveguide. In the thin-film optical element-free region, low-loss light transmission is achieved without interaction between transmitted light and the substrate.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: February 17, 2004
    Assignee: Kyocera Corporation
    Inventors: Katsuhiro Kaneko, Shigeo Tanahashi, Tokuichi Yamaji, Shinichi Abe, Yuriko Ueno
  • Publication number: 20020081056
    Abstract: An object of the invention is to provide an optical integrated circuit substrate capable of establishing optical connection between an optical waveguide and a semiconductor light-receiving element with high light-receiving efficiency and of achieving low-loss light transmission. In the optical integrated circuit substrate, on a substrate is formed an optical waveguide having a clad and a core layer. Embedded in the optical waveguide are a metal placement portion for an optical element and a thin-film optical element placed thereon. Distance between the thin-film optical element and the core layer is reduced. In a region free of the thin-film optical element, there is an adequate distance between the core layer and the substrate. This allows satisfactory optical connection between the thin-film optical element and the optical waveguide. In the thin-film optical element-free region, low-loss light transmission is achieved without interaction between transmitted light and the substrate.
    Type: Application
    Filed: October 30, 2001
    Publication date: June 27, 2002
    Applicant: KYOCERA CORPORATION
    Inventors: Katsuhiro Kaneko, Shigeo Tanahashi, Tokuichi Yamaji, Shinichi Abe, Yuriko Ueno
  • Patent number: 6060664
    Abstract: A prior-art electronic circuit component comprising an insulating film and a circuit conductive layer made of a superconducting metal suffers low reliability resulting from insufficient adhesion between these layers. An electronic circuit component of the invention comprises an insulating film made of a high polymer material having a dielectric constant of 2.5 or less, a base metal layer formed of copper on the insulating film, having a thickness of 0.01 to 0.3 .mu.m, and a circuit conductive layer formed of at least one of niobium and niobium nitride on the base metal layer. The electronic circuit component of the invention can accomplish an increased adhesion between the insulating film and the circuit conductive layer.
    Type: Grant
    Filed: June 26, 1998
    Date of Patent: May 9, 2000
    Assignee: Kyocera Corporation
    Inventors: Shigeo Tanahashi, Tokuichi Yamaji