Patents by Inventor Tokumi Ikeda

Tokumi Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8470155
    Abstract: In order to produce industrially advantageously an electroformed copper/niobium composite piping material wherein an electroformed copper layer and a niobium thin piping material are strongly bonded to each other, the electroformed copper/niobium composite piping material can be produced by coating any one or each of the outer peripheral surface and the inner peripheral surface of a niobium thin piping material with a nickel thin film, coating the surface of the nickel thin film with copper by electroforming, and subsequently annealing the resultant.
    Type: Grant
    Filed: May 29, 2006
    Date of Patent: June 25, 2013
    Assignees: High Energy Accelerator Research Organization, Nomura Plating Co., Ltd.
    Inventors: Kenji Saito, Tokumi Ikeda, Tamao Higuchi
  • Patent number: 7896061
    Abstract: The objective of the present invention is to provide a product that is superior in barrier properties (for example, zinc erosion resistance and anti-adhesive property), abrasion resistant property, surface hardening property, thermal stability and life-time prolonging property. The product, which is made in direct contact with molten metal containing zinc in a molten state, is characterized by including an iron-tungsten alloy coating that is applied to a part or the whole of the surface of the product that comes directly in contact with the molten metal.
    Type: Grant
    Filed: February 1, 2006
    Date of Patent: March 1, 2011
    Assignees: Nomura Plating Co., Ltd., Osaka Prefectural Government
    Inventors: Keiji Nakai, Tokumi Ikeda, Takahiro Hamada, Tsutomu Morikawa, Takashi Nishimura, Takuo Nakade
  • Publication number: 20100066273
    Abstract: In order to produce industrially advantageously an electroformed copper/niobium composite piping material wherein an electroformed copper layer and a niobium thin piping material are strongly bonded to each other, the electroformed copper/niobium composite piping material can be produced by coating any one or each of the outer peripheral surface and the inner peripheral surface of a niobium thin piping material with a nickel thin film, coating the surface of the nickel thin film with copper by electroforming, and subsequently annealing the resultant.
    Type: Application
    Filed: May 29, 2006
    Publication date: March 18, 2010
    Inventors: Kenji Saito, Tokumi Ikeda, Tamao Higuchi
  • Publication number: 20090321268
    Abstract: The present invention is an electrodeposited film substantially containing no lead, characterized by applying an alloy layer or a simple metal layer with an Hv value of not less than 60 to an under layer, and an alloy layer or a simple metal layer with an Hv value of not more than 40 to an upper layer. This electrodeposited film is harmless to the human body and the environment, and superior in sliding properties.
    Type: Application
    Filed: February 13, 2007
    Publication date: December 31, 2009
    Inventors: Kunio Nakashima, Wataru Yago, Kenichi Ichida, Kazuo Takeuchi, Tokumi Ikeda, Kunio Nakaniwa
  • Publication number: 20080149297
    Abstract: The objective of the present invention is to provide a product that is superior in barrier properties (for example, zinc erosion resistance and anti-adhesive property), abrasion resistant property, surface hardening property, thermal stability and life-time prolonging property. The product, which is made in direct contact with molten metal containing zinc in a molten state, is characterized by including an iron-tungsten alloy coating that is applied to a part or the whole of the surface of the product that comes directly in contact with the molten metal.
    Type: Application
    Filed: February 1, 2006
    Publication date: June 26, 2008
    Inventors: Keiji Nakai, Tokumi Ikeda, Takahiro Hamada, Tsutomu Morikawa, Takashi Nishimura, Takuo Nakade
  • Publication number: 20060099443
    Abstract: The present invention is an electrodeposited film substantially containing no lead, characterized by applying an alloy layer or a simple metal layer with an Hv value of not less than 60 to an under layer, and an alloy layer or a simple metal layer with an Hv value of not more than 40 to an upper layer. This electrodeposited film is harmless to the human body and the environment, and superior in sliding properties.
    Type: Application
    Filed: January 14, 2004
    Publication date: May 11, 2006
    Inventors: Kunio Nakashima, Wataru Yago, Kenichi Ichida, Kazuo Takeuchi, Tokumi Ikeda, Kunio Nakaniwa
  • Patent number: 6059881
    Abstract: A coater blade and backing roll combination contains a coater blade having an elastic steel blade with a wear-resistant coating formed thereon. The wear-resistant coating has a hardness greater than that of the elastic steel blade and is provided on an edge of the blade to define a coater surface for contacting with a moving surface of coated paper on the backing roll. The backing roll has a concave outer surface having a curvature corresponding to a quadratic equation and the coater surface has a concave curvature corresponding to the quadratic equation.
    Type: Grant
    Filed: August 4, 1993
    Date of Patent: May 9, 2000
    Assignee: Nomura Techno Research Kabushiki Kaisha
    Inventors: Hirotoshi Nomura, Keiji Nakayama, Hisakazu Takagishi, Tokumi Ikeda
  • Patent number: 5564196
    Abstract: A roll used for tensioning a canvas belt used to hold paper against a dryer. The roll includes a main cylindrical body formed of steel. A layer formed of a metal harder than steel is disposed over the outer surface of the main body. The metal layer is formed with a channel around its center so as to define two spaced roll end sections of a common diameter. A fluororesin layer is disposed in the metal layer channel and is shaped so as to have an outer surface of a diameter equal to that of the metal layer end sections.
    Type: Grant
    Filed: September 23, 1994
    Date of Patent: October 15, 1996
    Assignee: Nomura Techno Research Kabushiki Kaisha
    Inventors: Hirotoshi Nomura, Keiji Nakayama, Yasushi Kitamura, Hajime Miwa, Tokumi Ikeda
  • Patent number: 4949773
    Abstract: This invention relates to a production method of a mold for continuous casting comprising the steps of: providing a cooled water path in the mold water cooling mechanism; filling the cooled water path with a wax; making the wax surface uniform; providing a copper or copper alloy stratum on the wax surface by electrolytic plating; removing wax from the cooled water path and uniting the mold water cooling mechanism with the mold as one; and comprising the additional step of providing a copper or nickel plating on the surface on which is provided the cooled water path in the mold water cooling mechanism before depositing wax in the path.
    Type: Grant
    Filed: August 11, 1989
    Date of Patent: August 21, 1990
    Assignee: Techno Research Kabushiki
    Inventors: Hirotoshi Nomura, Tokumi Ikeda