Patents by Inventor Tokuo Naitou

Tokuo Naitou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light illumination during wafer dicing to prevent aluminum corrosion
    Patent number: 7998793
    Abstract: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 ?m or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.
    Type: Grant
    Filed: May 2, 2009
    Date of Patent: August 16, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Takashi Sato, Junichi Takano, Takashi Sato, Tokuo Naitou
  • MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    Publication number: 20090215247
    Abstract: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 ?m or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.
    Type: Application
    Filed: May 2, 2009
    Publication date: August 27, 2009
    Inventors: Takashi Sato, Junichi Takano, Takashi Sato, Tokuo Naitou
  • Manufacturing Method of Semiconductor Device
    Publication number: 20080138962
    Abstract: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 ?m or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.
    Type: Application
    Filed: July 22, 2004
    Publication date: June 12, 2008
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Takashi Sato, Junichi Takano, Takashi Sato, Tokuo Naitou