Abstract: The present invention aims to provide a temporary fixing material that is easily separable even after high-temperature processing at 300° C. or higher with an adherend fixed thereon. The present invention also aims to provide a method for producing an electronic component using the temporary fixing material. Provided is a temporary fixing material containing a photocurable adhesive, the photocurable adhesive containing a reactive resin containing a resin (1) having an imide skeleton in a backbone repeating unit, the temporary fixing material having a light transmittance at 405 nm of 10% or greater and a 5% weight loss temperature of 350° C. or higher.

Abstract: The present invention aims to provide a curable resin composition that can reduce the occurrence of voids and partial detachment between the composition and a support even in high-temperature processing at 300° C. or higher with an adherend fixed to the support with the composition, and is easily separable after the high-temperature processing. The present invention also aims to provide a temporary fixing material including an adhesive layer containing the curable resin composition and a method of producing an electronic component using the temporary fixing material. Provided is a curable resin composition containing: a maleimide group-containing reactive compound (1); and a resin (2) having an imide skeleton in a backbone repeating unit.

Abstract: The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.

Abstract: The present invention aims to provide an adhesive composition that is easily separable by irradiation with light even after high-temperature processing at 300° C. or higher with an adherend fixed thereon, an adhesive tape including an adhesive layer formed of the adhesive composition, and a method for processing an electronic component. The present invention is an adhesive composition including: a reactive resin having an imide backbone and containing a double bond-containing functional group in a side chain or at an end; and a silicone compound or a fluorine compound.

Abstract: The present invention has it for its object to provide an interlayer film for laminated glass and a laminated glass which shows a much decreased extent of blushing of the peripheral region thereof even when placed in a high-humidity atmosphere, without compromise in those fundamental performance characteristics which are required of laminated glass, such as transparency, weather resistance, adhesion and penetration resistance. The present invention is related to an interlayer film for laminated glass comprising a plasticized poly(vinyl acetal) resin and having the haze after 24 hours of immersion is not more than 50% when said interlayer film with a thickness of 0.3 to 0.8 mm is immersed in water at 23° C.

Abstract: It is an object of the present invention to provide an adhesive for sealing an organic electroluminescence device, an adhesive tape for sealing an organic electroluminescence device, a double-faced adhesive tape for sealing an organic electroluminescence device, a method of sealing an organic electroluminescence device and an organic electroluminescence device, which can seal an organic electroluminescence device without degrading it with light or heat. The present invention relates to an adhesive for sealing an organic electroluminescence device, which comprises a photo cationic polymerizable adhesive containing a photo cationic polymerizable compound and a photo cationic polymerization initiator and, initiating a curing reaction by light irradiation and proceeding the curing reaction by a dark reaction even after interrupting the light irradiation.

Abstract: The present invention has for its object to provide an intermediate film for laminated glass which does not give rise to the trouble of poor appearance in its lamination with glass and can be easily produced without remodeling of the existing production equipment and superior in productivity.

Abstract: The present invention has it for its object to provide an interlayer film for laminated glass and a laminated glass which shows a much decreased extent of blushing of the peripheral region thereof even when placed in a high-humidity atmosphere, without compromise in those fundamental performance characteristics which are required of laminated glass, such as transparency, weather resistance, adhesion and penetration resistance.

Abstract: The present invention has it for its object to provide an interlayer film for laminated glass and a laminated glass which shows a much decreased extent of blushing of the peripheral region thereof even when placed in a high-humidity atmosphere, without compromise in those fundamental performance characteristics which are required of laminated glass, such as transparency, weather resistance, adhesion and penetration resistance. The present invention is related to an interlayer film for laminated glass comprising a plasticized poly(vinyl acetal) resin and having the haze after 24 hours of immersion is not more than 50% when said interlayer film with a thickness of 0.3 to 0.8 mm is immersed in water at 23° C.

Abstract: The present invention has it for its object to provide an interlayer film for laminated glass and a laminated glass which shows a much decreased extent of blushing of the peripheral region thereof even when placed in a high-humidity atmosphere, without compromise in those fundamental performance characteristics which are required of laminated glass, such as transparency, weather resistance, adhesion and penetration resistance.