Abstract: A circuit board for a semiconductor device inspection apparatus can have a small thermal expansion coefficient and high mechanical strength and can be easily manufactured with a reduced manufacturing cost. Furthermore, the circuit board includes a metal base body obtained by stacking and bonding a multiple number of metal plates, each having a through hole formed by an etching, such that the through holes of the metal plates are overlapped with each other to form a through hole; a resin layer formed on surfaces of the metal base body and on an inner wall surface of the through hole of the metal base body; and a conductor pattern formed to be electrically insulated from the metal base body by the resin layer.