Patents by Inventor Tolga Acikalin
Tolga Acikalin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12366713Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. A back surface of the photonic integrated circuit device may thermally coupled to the heat dissipation structure within the package substrate for the removal of heat from the photonic integrated circuit device, which allows for access to an active surface of the photonic integrated circuit device for the attachment of fiber optic cables and eliminates the need for a heat dissipation device to be thermally attached to the active surface of the photonic integrated circuit device.Type: GrantFiled: June 10, 2021Date of Patent: July 22, 2025Assignee: Intel CorporationInventors: Omkar Karhade, Tolga Acikalin, Sushrutha Gujjula, Kelly Lofgreen, Ravindranath Mahajan, Chia-pin Chiu
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Publication number: 20250218961Abstract: An apparatus includes a package substrate comprising a core having a first surface along a first plane and a second surface along a second plane, a semiconductor device disposed within an opening in the core, the semiconductor device having a third surface along a third plane and a fourth surface along a fourth plane, the third plane substantially parallel to the first plane, a first dielectric material disposed on the first surface of the core, the first dielectric material extends into the opening to fill a first gap between a wall of the opening and a lateral surface of the semiconductor device, and a second dielectric material disposed on the second surface of the core, the second dielectric material extends into the opening to fill a second gap between the second plane and the fourth plane.Type: ApplicationFiled: December 28, 2023Publication date: July 3, 2025Inventors: Tolga Acikalin, Benjamin Duong, Soham Agarwal, Jeremy Ecton, Kari Hernandez, Brandon Christian Marin, Pratyush Mishra, Pratyasha Mohapatra, Srinivas Venkata Ramanuja Pietambaram, Marcel Said
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Publication number: 20250219301Abstract: A device may include a plurality of carriers, wherein each carrier includes a plurality of communication processors, each communication processor disposed over or in a respective carrier of the plurality of carriers and configured to provide a wireless broadcasting communication channel, and a plurality of antennas, each antenna disposed on or in a respective carrier and coupled to a respective communication processor, wherein each antenna extends into a corner of the respective carrier, and wherein the antennas of each pair of adjacent carriers are positioned at a distance from each other at less than about 1 wavelength corresponding to the lowest operating frequency.Type: ApplicationFiled: December 28, 2023Publication date: July 3, 2025Inventors: Tae Young YANG, Tolga ACIKALIN, Shuhei YAMADA, Kenneth P. FOUST, Mostafa Naguib ABDULLA, Stefano PELLERANO, Zhen ZHOU
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Publication number: 20250218952Abstract: Embodiments disclosed herein include components that are embedded within a core of a package substrate. In an embodiment, such an apparatus may comprise a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a cavity is provided through a thickness of the substrate, and a first layer is in the cavity. In an embodiment, the first layer has a first width. In an embodiment, a component is on the first layer, and the component has a second width that is smaller than the first width. In an embodiment, a second layer is provided between a sidewall of the cavity and a sidewall of the component.Type: ApplicationFiled: December 28, 2023Publication date: July 3, 2025Inventors: Benjamin DUONG, Tolga ACIKALIN, Soham AGARWAL, Jeremy D. ECTON, Kari HERNANDEZ, Brandon C. MARIN, Pratyush MISHRA, Pratyasha MOHAPATRA, Srinivas Venkata Ramanuja PIETAMBARAM, Marcel SAID, Bohan SHAN, Gang DUAN
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Publication number: 20250218963Abstract: An apparatus includes a substrate core, which has a first height between a first surface and a second surface opposite the first surface. A die is within the substrate core. The die may include a deep trench capacitor. The die has a second height between a first side of the die and a second side opposite the first side. The first height is greater than the second height. A plurality of conductive vias extend from a plurality of conductive contacts at the first side of the die to the first surface of the substrate core. A material comprising a dielectric is disposed over the die and encapsulates the plurality of conductive vias. In some embodiments, a bond film is in contact with the second side of the die.Type: ApplicationFiled: December 28, 2023Publication date: July 3, 2025Applicant: Intel CorporationInventors: Hiroki Tanaka, Robert May, Bai Nie, Srinivas Pietambaram, Bohan Shan, Gang Duan, Benjamin Duong, Tolga Acikalin, Soham Agarwal, Jeremy Ecton, Kari Hernandez, Brandon Marin, Pratyush Mishra, Pratyasha Mohapatra, Marcel Said
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Publication number: 20250218915Abstract: An apparatus comprising a package substrate comprising a core layer; a pedestal embedded in the core layer; and a structure comprising a passive circuit component, wherein the structure is above the pedestal and is embedded in the core layer.Type: ApplicationFiled: December 29, 2023Publication date: July 3, 2025Applicant: Intel CorporationInventors: Tolga Acikalin, Soham Agarwal, Benjamin T. Duong, Jeremy D. Ecton, Kari E. Hernandez, Brandon Christian Marin, Pratyush Mishra, Pratyasha Mohapatra, Srinivas V. Pietambaram, Marcel M. Said, Gang Duan, Hiroki Tanaka, Robert A. May, Bai Nie, Sanjay Tharmarajah, Bohan Shan
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Publication number: 20250218983Abstract: Microelectronic integrated circuit package structures include one or more trench capacitors extending through a portion a device structure. The device structure is embedded within a portion of a core layer of a multi core package substrate, wherein one or more conductive interconnect structures are coupled with the one or more trench capacitors. A thickness of the device structure is equal to a thickness of the core layer.Type: ApplicationFiled: December 29, 2023Publication date: July 3, 2025Applicant: Intel CorporationInventors: Benjamin Duong, Kari Hernandez, Tolga Acikalin, Soham Agarwal, Jeremy Ecton, Brandon Marin, Pratyush Mishra, Pratyasha Mohaptra, Srinivas Pietambaram, Marcel Said
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Publication number: 20250219040Abstract: Technologies for components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.Type: ApplicationFiled: December 28, 2023Publication date: July 3, 2025Inventors: Tolga ACIKALIN, Soham AGARWAL, Benjamin T. DUONG, Jeremy D. ECTON, Kari E. HERNANDEZ, Brandon Christian MARIN, Pratyush MISHRA, Pratyasha MOHAPATRA, Srinivas Venkata Ramanuja PIETAMBARAM, Marcel M. SAID, Suddhasattwa NAD, Gang DUAN, Zhixin XIE, Jung Kyu HAN, Mohamed R. SABER, Shuren QU, Naiya SOETAN-DODD, Teng SUN, Yuxin FANG
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Publication number: 20250201787Abstract: Apparatus and methods for embedding deep trench capacitors (DTCs) in a package substrate. The method includes fabricating an integrated circuit on a silicon substrate core and identifying a deep trench capacitor (DTC) component to integrate with the integrated circuit. A cavity is created in the silicon substrate core to accommodate the DTC component. The cavity extends therethrough, like a through-hole. A temporary carrier is attached to the silicon substrate to create a cavity floor. A gap magnitude is determined, which is a difference between the thickness of the silicon substrate core and the thickness of the DTC component. An epoxy material with a minimum bond line that matches the gap magnitude is selected and implemented to fill the gap in fabrication. The minimum bond line is controlled by selection of particles to use in the epoxy material.Type: ApplicationFiled: December 18, 2023Publication date: June 19, 2025Applicant: Intel CorporationInventors: Marcel M. Said, Tolga Acikalin, Soham Agarwal, Benjamin T. Duong, Jeremy D. Ecton, Kari E. Hernandez, Brandon Christian Marin, Pratyush Mishra, Pratyasha Mohapatra, Srinivas Venkata Ramanuja Pietambaram
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Publication number: 20250192418Abstract: A wireless chip-to-chip device includes a first semiconductor substrate comprising a first antenna, configured to emit a radiofrequency signal; a second semiconductor substrate comprising a second antenna and configured to receive the radiofrequency signal; and a waveguide, positioned between the first semiconductor substrate and the second semiconductor substrate.Type: ApplicationFiled: July 28, 2022Publication date: June 12, 2025Inventors: Tae Young YANG, Tolga ACIKALIN, Issy KIPNIS, Mehnaz RAHMAN, Georgios DOGIAMIS, Bryce D. HORINE
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Patent number: 12327814Abstract: An electronic substrate may be fabricated having a core comprising a laminate including a metal layer between a first insulator layer and a second insulator layer, a metal via through the core, and metallization features on a first side and a second side of the core, wherein first ones of the metallization features are embedded within dielectric material on the first side of the core, and wherein a sidewall of the dielectric material and of the first insulator layer defines a recess over an area of the metal layer. In an embodiment of the present description, an integrated circuit package may be formed with the electronic substrate, wherein at least two integrated circuit devices may be attached to the electronic substrate. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.Type: GrantFiled: June 10, 2021Date of Patent: June 10, 2025Assignee: Intel CorporationInventors: Brandon C. Marin, Sai Vadlamani, Omkar Karhade, Tolga Acikalin
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Publication number: 20250112357Abstract: The present disclosure relates to a semiconductor package comprising a substrate, a radio frequency integrated circuit attached to the substrate, optionally at least one semiconductor die attached to the substrate and coupled to a radio frequency integrated circuit (RFIC) via one or more signal lines, a molding compound encapsulating the RFIC and the optional semiconductor die, and an antenna formed on the molding compound and coupled to the RFIC.Type: ApplicationFiled: August 28, 2024Publication date: April 3, 2025Inventors: Zhen ZHOU, Tae Young YANG, Shuhei YAMADA, Tolga ACIKALIN, Renzhi LIU, Kenneth FOUST, Bryce HORINE
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Publication number: 20240421465Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die. The example apparatus further includes a package substrate supporting the semiconductor die. The package substrate includes a glass core. The example apparatus also includes an antenna within the glass core.Type: ApplicationFiled: June 13, 2023Publication date: December 19, 2024Inventors: Tolga Acikalin, Tae Young Yang, Shuhei Yamada, Telesphor Kamgaing
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Publication number: 20240421062Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die and a substrate including a glass core. The apparatus also includes a pluggable interconnect including a portion of the glass core. The pluggable interconnect includes a transmission line extending along the portion of the glass core.Type: ApplicationFiled: June 13, 2023Publication date: December 19, 2024Inventors: Tolga Acikalin, Shuhei Yamada, Telesphor Kamgaing, Tae Young Yang
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Publication number: 20240314529Abstract: The subject matter described herein presents various technical solutions for the technical problems facing autonomous vehicles (e.g., fully autonomous and semi-autonomous vehicles). To address technical problems facing wireless communication cost and latency, a heterogeneous roadside infrastructure can be used to improve the ability for a vehicle to communicate with a data source. To address technical problems facing interruption of vehicle services due to an abrupt loss of connection, a quality of service system provides the ability to determine and share quality of service information, such as location-based information, maps, interference data, and other quality of service information. To address technical problems facing high volume data upload and download between autonomous vehicles and cloud-based data services, optical wireless communication (OWC) provides increased data throughput and reduced complexity and may be beneficial for short-range high-mobility wireless communications.Type: ApplicationFiled: May 23, 2024Publication date: September 19, 2024Inventors: Hassnaa Moustafa, Bahareh Sadeghi, Shengbo Xu, Tolga Acikalin, Javier Perez-Ramirez, Richard D. Roberts
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Patent number: 12082086Abstract: The subject matter described herein presents various technical solutions for the technical problems facing autonomous vehicles (e.g., fully autonomous and semi-autonomous vehicles). To address technical problems facing wireless communication cost and latency, a heterogeneous roadside infrastructure can be used to improve the ability for a vehicle to communicate with a data source. To address technical problems facing interruption of vehicle services due to an abrupt loss of connection, a quality of service system provides the ability to determine and share quality of service information, such as location-based information, maps, interference data, and other quality of service information. To address technical problems facing high volume data upload and download between autonomous vehicles and cloud-based data services, optical wireless communication (OWC) provides increased data throughput and reduced complexity, and may be beneficial for short-range high-mobility wireless communications.Type: GrantFiled: March 29, 2019Date of Patent: September 3, 2024Assignee: Apple Inc.Inventors: Hassnaa Moustafa, Bahareh Sadeghi, Shengbo Xu, Tolga Acikalin, Javier Perez-Ramirez, Richard D. Roberts
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Publication number: 20240222859Abstract: An apparatus may include a substrate including: a first antenna configured to form a first short range wireless interconnection with a first antenna of a further substrate, a second antenna spaced apart from the first antenna, the second antenna is configured to form a second short range wireless interconnection with a second antenna of the further substrate, and a metamaterial configured to form a surface with effective negative permeability within a space formed between a surface of the substrate and a surface of the further substrate for an established short range wireless interconnection of the first short range wireless interconnection and the second short range wireless interconnection.Type: ApplicationFiled: December 29, 2022Publication date: July 4, 2024Inventors: Tae Young YANG, Zhen ZHOU, Shuhei YAMADA, Tolga ACIKALIN, Kenneth P. FOUST, Bryce D. HORINE
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Patent number: 12009321Abstract: In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.Type: GrantFiled: December 23, 2020Date of Patent: June 11, 2024Assignee: Intel CorporationInventors: Zhen Zhou, Tae Young Yang, Tolga Acikalin, Johanny Escobar Pelaez, Kenneth P. Foust, Chia-Pin Chiu, Renzhi Liu, Cheng-Yuan Chin
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Publication number: 20240176167Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core where the core comprises glass. In an embodiment, the package substrate further comprises an optical waveguide over the core, and an optical phase change material over the optical waveguide.Type: ApplicationFiled: November 29, 2022Publication date: May 30, 2024Inventors: Benjamin DUONG, Kristof DARMAWIKARTA, Tolga ACIKALIN, Harel FRISH, Sandeep GAAN, John HECK, Eric J. M. MORET, Suddhasattwa NAD, Haisheng RONG
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Publication number: 20240113807Abstract: The present disclosure relates to a device which includes a processor configured to: select, using sensor data, an error correction code from two or more error correction codes, the sensor data representing a physical state of the processor and/or the device; generate channel-coded data by channel-coding input data using the selected error correction code; and provide a representation of the channel-coded data to a transmitter for wireless data transmission.Type: ApplicationFiled: August 11, 2023Publication date: April 4, 2024Inventors: Richard DORRANCE, Tolga ACIKALIN, Kenneth P. FOUST, Renzhi LIU