Patents by Inventor Tolga Acikalin
Tolga Acikalin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250112357Abstract: The present disclosure relates to a semiconductor package comprising a substrate, a radio frequency integrated circuit attached to the substrate, optionally at least one semiconductor die attached to the substrate and coupled to a radio frequency integrated circuit (RFIC) via one or more signal lines, a molding compound encapsulating the RFIC and the optional semiconductor die, and an antenna formed on the molding compound and coupled to the RFIC.Type: ApplicationFiled: August 28, 2024Publication date: April 3, 2025Inventors: Zhen ZHOU, Tae Young YANG, Shuhei YAMADA, Tolga ACIKALIN, Renzhi LIU, Kenneth FOUST, Bryce HORINE
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Publication number: 20240421465Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die. The example apparatus further includes a package substrate supporting the semiconductor die. The package substrate includes a glass core. The example apparatus also includes an antenna within the glass core.Type: ApplicationFiled: June 13, 2023Publication date: December 19, 2024Inventors: Tolga Acikalin, Tae Young Yang, Shuhei Yamada, Telesphor Kamgaing
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Publication number: 20240421062Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die and a substrate including a glass core. The apparatus also includes a pluggable interconnect including a portion of the glass core. The pluggable interconnect includes a transmission line extending along the portion of the glass core.Type: ApplicationFiled: June 13, 2023Publication date: December 19, 2024Inventors: Tolga Acikalin, Shuhei Yamada, Telesphor Kamgaing, Tae Young Yang
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Publication number: 20240314529Abstract: The subject matter described herein presents various technical solutions for the technical problems facing autonomous vehicles (e.g., fully autonomous and semi-autonomous vehicles). To address technical problems facing wireless communication cost and latency, a heterogeneous roadside infrastructure can be used to improve the ability for a vehicle to communicate with a data source. To address technical problems facing interruption of vehicle services due to an abrupt loss of connection, a quality of service system provides the ability to determine and share quality of service information, such as location-based information, maps, interference data, and other quality of service information. To address technical problems facing high volume data upload and download between autonomous vehicles and cloud-based data services, optical wireless communication (OWC) provides increased data throughput and reduced complexity and may be beneficial for short-range high-mobility wireless communications.Type: ApplicationFiled: May 23, 2024Publication date: September 19, 2024Inventors: Hassnaa Moustafa, Bahareh Sadeghi, Shengbo Xu, Tolga Acikalin, Javier Perez-Ramirez, Richard D. Roberts
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Patent number: 12082086Abstract: The subject matter described herein presents various technical solutions for the technical problems facing autonomous vehicles (e.g., fully autonomous and semi-autonomous vehicles). To address technical problems facing wireless communication cost and latency, a heterogeneous roadside infrastructure can be used to improve the ability for a vehicle to communicate with a data source. To address technical problems facing interruption of vehicle services due to an abrupt loss of connection, a quality of service system provides the ability to determine and share quality of service information, such as location-based information, maps, interference data, and other quality of service information. To address technical problems facing high volume data upload and download between autonomous vehicles and cloud-based data services, optical wireless communication (OWC) provides increased data throughput and reduced complexity, and may be beneficial for short-range high-mobility wireless communications.Type: GrantFiled: March 29, 2019Date of Patent: September 3, 2024Assignee: Apple Inc.Inventors: Hassnaa Moustafa, Bahareh Sadeghi, Shengbo Xu, Tolga Acikalin, Javier Perez-Ramirez, Richard D. Roberts
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Publication number: 20240222859Abstract: An apparatus may include a substrate including: a first antenna configured to form a first short range wireless interconnection with a first antenna of a further substrate, a second antenna spaced apart from the first antenna, the second antenna is configured to form a second short range wireless interconnection with a second antenna of the further substrate, and a metamaterial configured to form a surface with effective negative permeability within a space formed between a surface of the substrate and a surface of the further substrate for an established short range wireless interconnection of the first short range wireless interconnection and the second short range wireless interconnection.Type: ApplicationFiled: December 29, 2022Publication date: July 4, 2024Inventors: Tae Young YANG, Zhen ZHOU, Shuhei YAMADA, Tolga ACIKALIN, Kenneth P. FOUST, Bryce D. HORINE
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Patent number: 12009321Abstract: In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.Type: GrantFiled: December 23, 2020Date of Patent: June 11, 2024Assignee: Intel CorporationInventors: Zhen Zhou, Tae Young Yang, Tolga Acikalin, Johanny Escobar Pelaez, Kenneth P. Foust, Chia-Pin Chiu, Renzhi Liu, Cheng-Yuan Chin
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Publication number: 20240176167Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core where the core comprises glass. In an embodiment, the package substrate further comprises an optical waveguide over the core, and an optical phase change material over the optical waveguide.Type: ApplicationFiled: November 29, 2022Publication date: May 30, 2024Inventors: Benjamin DUONG, Kristof DARMAWIKARTA, Tolga ACIKALIN, Harel FRISH, Sandeep GAAN, John HECK, Eric J. M. MORET, Suddhasattwa NAD, Haisheng RONG
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Publication number: 20240113807Abstract: The present disclosure relates to a device which includes a processor configured to: select, using sensor data, an error correction code from two or more error correction codes, the sensor data representing a physical state of the processor and/or the device; generate channel-coded data by channel-coding input data using the selected error correction code; and provide a representation of the channel-coded data to a transmitter for wireless data transmission.Type: ApplicationFiled: August 11, 2023Publication date: April 4, 2024Inventors: Richard DORRANCE, Tolga ACIKALIN, Kenneth P. FOUST, Renzhi LIU
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Publication number: 20240113438Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Inventors: Zhen ZHOU, Shuhei YAMADA, Renzhi LIU, Tae Young YANG, Tolga ACIKALIN, Kenneth P. FOUST
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Publication number: 20240106126Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.Type: ApplicationFiled: July 14, 2023Publication date: March 28, 2024Inventors: Zhen ZHOU, Tolga ACIKALIN, Kenneth FOUST, Shuhei YAMADA, Tae Young YANG, Timothy F. COX, Renzhi LIU, Richard DORRANCE, Johanny ESCOBAR PELAEZ
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Publication number: 20240021522Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.Type: ApplicationFiled: December 23, 2020Publication date: January 18, 2024Inventors: Tolga ACIKALIN, Tae Young YANG, Debabani CHOUDHURY, Shuhei YAMADA, Roya DOOSTNEJAD, Hosein NIKOPOUR, Issy KIPNIS, Oner ORHAN, Mehnaz RAHMAN, Kenneth P. FOUST, Christopher D. HULL, Telesphor KAMGAING, Omkar KARHADE, Stefano PELLERANO, Peter SAGAZIO, Sai VADLAMANI
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Publication number: 20230420396Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.Type: ApplicationFiled: December 23, 2020Publication date: December 28, 2023Inventors: Tolga ACIKALIN, Arnaud AMADJIKPE, Brent R. CARLTON, Chia-Pin CHIU, Timothy F. COX, Kenneth P. FOUST, Bryce D. HORINE, Telesphor KAMGAING, Renzhi LIU, Jason A. MIX, Sai VADLAMANI, Tae Young YANG, Zhen ZHOU
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Publication number: 20230411369Abstract: In one embodiment, an integrated circuit package includes a package substrate with a cavity, an integrated circuit device, a bridge, a photonic integrated circuit (PIC), and an electronic integrated circuit (EIC). The integrated circuit device is electrically coupled to the package substrate. The bridge and the PIC are in the cavity of the package substrate, and the bridge is electrically coupled to the package substrate. The EIC is above, and electrically coupled to, the bridge and the PIC.Type: ApplicationFiled: June 15, 2022Publication date: December 21, 2023Applicant: Intel CorporationInventors: Omkar G. Karhade, Kaveh Hosseini, Chia-Pin Chiu, Tim T. Hoang, Tolga Acikalin, Cooper S. Levy
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Publication number: 20230207405Abstract: Embodiments disclosed herein include electronic devices. In an embodiment, an electronic device comprises a core, where the core comprises a first layer comprising glass, and a second layer comprising glass over the first layer. In an embodiment, a trace is between the first layer and the second layer. In an embodiment, routing layers are on the core.Type: ApplicationFiled: December 24, 2021Publication date: June 29, 2023Inventors: Arghya SAIN, Andrew P. COLLINS, Sivaseetharaman PANDI, Telesphor KAMGAING, Tolga ACIKALIN, Shuhei YAMADA
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Publication number: 20220416428Abstract: Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.Type: ApplicationFiled: June 24, 2021Publication date: December 29, 2022Inventors: Zhen Zhou, Tae Young Yang, Shuhei Yamada, Tolga Acikalin, Johanny Escobar Pelaez, Kenneth Foust, Jason Mix, Renzhi Liu
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Publication number: 20220413236Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to thermally and/or electrically coupling a thermal die to the surface of a photonic integrated circuit (PIC) within an open cavity in a substrate, where the thermal die is proximate to a laser on the PIC. Other embodiments may be described and/or claimed.Type: ApplicationFiled: June 25, 2021Publication date: December 29, 2022Inventors: Omkar KARHADE, Sushrutha Reddy GUJJULA, Tolga ACIKALIN, Ravindranath V. MAHAJAN, James E. JAUSSI, Chia-Pin CHIU
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Publication number: 20220415742Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate, and a die, electrically coupled to the package substrate, including a silicon substrate having a first surface and an opposing second surface; a device layer at the first surface of the silicon substrate; and a dielectric layer, having a heater trace, at the second surface of the silicon substrate.Type: ApplicationFiled: June 23, 2021Publication date: December 29, 2022Applicant: Intel CorporationInventors: Bijoyraj Sahu, Tolga Acikalin, Anand Haridass, Vikrant Thigle
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Publication number: 20220399307Abstract: An electronic substrate may be fabricated having a core comprising a laminate including a metal layer between a first insulator layer and a second insulator layer, a metal via through the core, and metallization features on a first side and a second side of the core, wherein first ones of the metallization features are embedded within dielectric material on the first side of the core, and wherein a sidewall of the dielectric material and of the first insulator layer defines a recess over an area of the metal layer. In an embodiment of the present description, an integrated circuit package may be formed with the electronic substrate, wherein at least two integrated circuit devices may be attached to the electronic substrate. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.Type: ApplicationFiled: June 10, 2021Publication date: December 15, 2022Applicant: Intel CorporationInventors: Brandon C. Marin, Sai Vadlamani, Omkar Karhade, Tolga Acikalin
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Publication number: 20220397726Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. A back surface of the photonic integrated circuit device may thermally coupled to the heat dissipation structure within the package substrate for the removal of heat from the photonic integrated circuit device, which allows for access to an active surface of the photonic integrated circuit device for the attachment of fiber optic cables and eliminates the need for a heat dissipation device to be thermally attached to the active surface of the photonic integrated circuit device.Type: ApplicationFiled: June 10, 2021Publication date: December 15, 2022Applicant: Intel CorporationInventors: Omkar Karhade, Tolga Acikalin, Sushrutha Gujjula, Kelly Lofgreen, Ravindranath Mahajan, Chia-pin Chiu