Abstract: A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between the surface of the chip and the chip engaging surface of the heat sink. The liquid layer provides a low thermal resistance juncture between the chip engaging surface of the heat sink and the surface of the chip, which allows for greater heat transfer therebetween.

Abstract: A chip temperature sensor includes a support member, a resistance temperature detector (RTD), and signal leads. The support member is slidably mountable within a heat sink bore of a burn-in oven heat exchange system and includes first and second ends, a socket formed in the first end, a bore extending from the socket through the second end, and a flange positioned between the first and second ends. The RTD is seated in the socket and includes a chip contact surface that is raised relative to the first end. The RTD is configured to produce a temperature signal that is indicative of a temperature at the chip contact surface. The signal leads are attached to the RTD and extend through the bore of the support member and out the second end of the support member. A heat exchange system that includes the above-described chip temperature sensor.

Abstract: A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between the surface of the chip and the chip engaging surface of the heat sink. The liquid layer provides a low thermal resistance juncture between the chip engaging surface of the heat sink and the surface of the chip, which allows for greater heat transfer therebetween.

Abstract: The burn-in oven is provided with a plurality of chambers, and each of the chambers has a number of stacked burn-in boards carrying devices under test. Each burn-in board is associated with an overlying fan board. The fan board divides the space between the burn-in boards so that a duct is formed on a side of the fan board opposite from its associated burn-in board. The fan boards are spaced from the burn-in boards, so that there is a space overlying the devices under tests as well. Each of the fan boards has an individual fan associated with each underlying device under test, to provide air flow through an opening directly onto the device under test. The space between each burn-in board and its associated fan board is sealed with seal plates at opposite ends of the space, and at least one of the seal plates having an adjustable damper for providing a bleed flow of cooling air through the space.

Abstract: A heat sink is used for thermally controlling a chip on a burn-in board which is being tested in a burn-in oven. The heat sink includes a resiliently mounted block that will engage a chip under resilient pressure and which is housed in a separate cup that permits accommodating misalignments or shifting of the heat sink when it contacts the chip. Additionally, the block carries a temperature sensor that is resiliently loaded against a chip which the heat sink engages. A bore mounts the temperature sensor and is also connected to a source of helium to provide a layer of helium between a surface of the heat sink and the adjacent surface of the chip for modifying the thermal coupling between the heat sink and the chip.

Abstract: An automatic loading and unloading support for use on the interior of a burn-in oven includes a frame that supports a rack of printed circuit burn-in boards connected to connectors along edges of the burn-in boards at one end of the rack. The frame has a track for supporting the rack for movement from an open end toward a closed end of the oven. Driver/receiver boards are mounted at the closed end and have connectors aligning with the connectors on the burn-in boards on a rack. When the rack is moved to a position closely adjacent to the driver/receiver board connectors, alignment pins will align the rack properly and then actuators are used for moving inserter bars that press against the back side of the rack and push the connectors on the burn-in boards into the connectors on the driver/receiver boards.