Abstract: A chamber component for a process chamber comprises a ceramic body and one or more protective layer on at least one surface of the ceramic body, wherein the one or more protective layer comprises Y3Al5O12 having a dielectric constant of 9.76+/?up to 30% and a hermiticity of 4.4E-10 cm3/s+/?up to 30%.

Abstract: A chamber component for a process chamber comprises a ceramic body and one or more protective layer on at least one surface of the ceramic body, wherein the one or more protective layer comprises Y3Al5O12 having a dielectric constant of 9.76+/?up to 30% and a hermiticity of 4.4E-10 cm3/s+/?up to 30%.

Abstract: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Er2O3, Er3Al5O12, and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.

Abstract: An article includes a body that is coated with a ceramic coating. The ceramic coating may include Y2O3 in a range between about 45 mol % to about 99 mol %, ZrO2 in a range between about 1 mol % to about 55 mol %, and Al2O3 in a range between about 1 mol % to about 10 mol %. The ceramic coating may alternatively include Y2O3 in a range between about 45 mol % to about 99 mol % and Al2O3 in a range between about 1 mol % to about 10 mol %. The ceramic coating may alternatively include Y2O3 in a range between about 45 mol % to about 99 mol % and ZrO2 in a range between about 1 mol % to about 55 mol %.

Abstract: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Er2O3, Er3Al5O12, and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.

Abstract: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Y4Al2O9, Er2O3, Gd2O3, Er3Al5O12, Gd3Al5O12 and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.

Abstract: An component of a processing chamber comprises an aerosol deposited coating on the component, the aerosol deposited coating comprising a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle.

Abstract: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Y4Al2O9, Er2O3, Gd2O3, Er3Al5O12, Gd3Al5O12 and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.

Abstract: An article includes a body that is coated with a ceramic coating. The ceramic coating may include Y2O3 in a range between about 45 mol % to about 99 mol %, ZrO2 in a range between about 0 mol % to about 55 mol %, and Al2O3 in a range between about 0 mol % to about 10 mol %. The ceramic coating may alternatively include Y2O3 in a range between about 30 mol % to about 60 mol %, ZrO2 in a range between about 0 mol % to about 20 mol %, and Al2O3 in a range between about 30 mol % to about 60 mol %.

Abstract: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Y4Al2O9, Er2O3, Gd2O3, Er3Al5O12, Gd3Al5O12 and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.

Abstract: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Y4Al2O9, Er2O3, Gd2O3, Er3Al5O12, Gd3Al5O12 and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.

Abstract: An article includes a body that is coated with a ceramic coating. The ceramic coating may include Y2O3 in a range between about 45 mol % to about 99 mol %, ZrO2 in a range between about 0 mol % to about 55 mol %, and Al2O3 in range between about 0 mol % to about 10 mol %. The ceramic coating may alternatively inculde Y2O3 in a range between about 30 mol % to about 60 mol %, ZrO2 in a range between about 0 mol % to about 20 mol %, and Al2O3 in a range between about 30 mol % to about 60 mol %.

Abstract: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Y4Al2O9, Er2O3, Gd2O3, Er3Al5O12, Gd3Al5O12 and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.

Abstract: An component of a processing chamber comprises an aerosol deposited coating on the component, the aerosol deposited coating comprising a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle.

Abstract: A method for coating a component for use in a semiconductor chamber for plasma etching includes providing the component and loading the component in a deposition chamber. A pressure in the deposition chamber is reduced to below atmospheric pressure. A coating is deposited on the component by spraying an aerosol comprising a suspension of a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle onto the component at approximately room temperature.

Abstract: An article includes a body that is coated with a ceramic coating. The ceramic coating may include Y2O3 in a range between about 45 mol % to about 99 mol %, ZrO2 in a range between about 1 mol % to about 55 mol %, and Al2O3 in a range between about 1 mol % to about 10 mol %. The ceramic coating may alternatively include Y2O3 in a range between about 45 mol % to about 99 mol % and Al2O3 in a range between about 1 mol % to about 10 mol %. The ceramic coating may alternatively include Y2O3 in a range between about 45 mol % to about 99 mol % and ZrO2 in a range between about 1 mol % to about 55 mol %.

Abstract: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Y4Al2O9, Er2O3, Gd2O3, Er3Al5O12, Gd3Al5O12 and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.

Abstract: An article includes a body that is coated with a ceramic coating. The ceramic coating may include Y2O3 in a range between about 45 mol % to about 99 mol %, ZrO2 in a range between about 0 mol % to about 55 mol %, and Al2O3 in a range between about 0 mol % to about 10 mol %. The ceramic coating may alternatively include Y2O3 in a range between about 30 mol % to about 60 mol %, ZrO2 in a range between about 0 mol % to about 20 mol %, and Al2O3 in a range between about 30 mol % to about 60 mol %.

Abstract: A method for coating a component for use in a semiconductor chamber for plasma etching includes providing the component and loading the component in a deposition chamber. A pressure in the deposition chamber is reduced to below atmospheric pressure. A coating is deposited on the component by spraying an aerosol comprising a suspension of a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle onto the component at approximately room temperature.

Abstract: An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. One or more UV bulbs per process region that are covered by housings coupled to the lid emit UV light directed through the windows onto substrates located within the process regions. The UV bulbs can be an array of light emitting diodes or bulbs utilizing a source such as microwave or radio frequency. The UV light can be pulsed during a cure process. Using oxygen radical/ozone generated remotely and/or in-situ accomplishes cleaning of the chamber. Use of lamp arrays, relative motion of the substrate and lamp head, and real-time modification of lamp reflector shape and/or position can enhance uniformity of substrate illumination.