Abstract: A hybrid memory cell array including a preferable arrangement of a row decoder is proposed, and in the same manner of addressing a memory cell in the memory array a high access speed of the memory cell and high integration layout of a memory chip can be achieved. A hybrid memory cell includes a plurality of memory cells that each includes an electronic circuit to store binary logic values, a plurality of word lines, a plurality of bit lines, a row decoder arranged in the memory cell array to enable the plurality of word lines and select a memory cell on a same word line, and a column decoder arranged outside the memory cell array to enable the plurality of bit lines and select a memory cell on a same bit line.

Abstract: A hybrid memory cell array including a preferable arrangement of a row decoder is proposed, and in the same manner of addressing a memory cell in the memory array a high access speed of the memory cell and high integration layout of a memory chip can be achieved.

Abstract: A read-only memory device is provided which comprises an array of read-only memory cells arranged in rows and columns. An additional row or column of flat, single polysilicon floating gate memory cells is provided. A row or column decoder coupled to the array of read-only memory cells is responsive to addresses corresponding to rows or columns in the array for selecting addressed rows or columns. Control circuitry including a programmable store for identifying a defective row or column in the array to be replaced by the additional row or column, selects the additional row or column and replaces the defective row or column in response to an address corresponding to the defective row or column. In addition, circuitry is provided on the integrated circuit which allows access to the additional row or column of floating gate memory cells for programming the additional row or column.

Abstract: A circuit is provided for supplying a negative erasing voltage onto the wordlines of selected blocks in an array of floating gate memory cells. The circuit includes a voltage circuit, which has a plurality of local outputs, each of which connects to wordlines of an associated block of floating gate memory cells. A block selector circuit is coupled to the local outputs of the voltage circuit and selectively switches each of the local outputs to apply either an erasing voltage or a non-erasing voltage onto the wordlines of the associated block of floating gate memory cells. Negative wordline stress is thus reduced for wordlines of unselected blocks which receive a less negative, non-erasing voltage during block erase operations.

Abstract: An integrated circuit (IC) includes a functional module such as FLASH memory with automatic program and erase circuits, test circuitry coupled with the functional module which executes a test of the functional module and generates status information as a result of the test, and non-volatile status write circuitry coupled with the test circuitry on the chip. A circuit in the non-volatile status write circuitry is responsive to the test of the functional circuitry to write the status information to the non-volatile memory. A port on the integrated circuit is coupled to the non-volatile memory through which the status information stored in the non-volatile memory is accessible in a test read mode to external devices. In a FLASH EPROM embodiment, the IC includes an array of FLASH EPROM memory cells, a test set of FLASH EPROM memory cells, and a port through which data in the array is accessible by external devices.

Abstract: A circuit for speeding up the pre-programming of floating gate storage transistors such as FLASH EPROMS, and particularly speeding up the pre-programming of a block or array of floating gate storage transistors includes a controllable voltage source that supplies gate programming potential across the control gate and source of the FLASH EPROM transistor cells to be programmed. A control circuit is provided that controls the voltage source to vary the gate programming potential during a programming interval as a function of time in order to decrease the time required for a given amount of charge movement to program the selected floating gate transistors. The wordline voltages are varied, while the source voltage is held constant. By starting at a lower wordline voltage, and increasing during the programming interval to a high wordline voltage, the programming speed is increased, and the high final turn-on threshold voltage for the programmed floating gate storage transistors is achieved.

Abstract: A circuit for speeding up the pre-programming of floating gate storage transistors such as FLASH EPROMS, and particularly speeding up the pre-programming of a block or array of floating gate storage transistors includes a controllable voltage source that supplies gate programming potential across the control gate and source of the FLASH EPROM transistor cells to be programmed. A control circuit is provided that controls the voltage source to vary the gate programming potential during a programming interval as a function of time in order to decrease the time required for a given amount of charge movement to program the selected floating gate transistors. The wordline voltages are varied, while the source voltage is held constant. By starting at a lower wordline voltage, and increasing during the programming interval to a high wordline voltage, the programming speed is increased, and the high final turn-on threshold voltage for the programmed floating gate storage transistors is achieved.

Abstract: A circuit for speeding up the pre-programming of floating gate storage transistors such as FLASH EPROMS, and particularly speeding up the pre-programming of a block or array of floating gate storage transistors includes a controllable voltage source that supplies gate programming potential across the control gate and source of the FLASH EPROM transistor cells to be programmed. A control circuit is provided that controls the voltage source to vary the gate programming potential during a programming interval as a function of time in order to decrease the time required for a given amount of charge movement to program the selected floating gate transistors. The wordline voltages are varied, while the source voltage is held constant. By starting at a lower wordline voltage, and increasing during the programming interval to a high wordline voltage, the programming speed is increased, and the high final turn-on threshold voltage for the programmed floating gate storage transistors is achieved.

Abstract: For non-volatile memory devices, such as flash EPROM integrated circuits, which have memory cells and reference cells, and sense circuitry responsive to addressed memory cells and the reference cells, and in which a read potential is supplied to the gate of the selected memory cells and a reference potential is supplied to the gate of a reference memory cell during a read mode, the state of the programmable memory cells is verified by (1) supplying a first verify potential to the gate of an address programmable memory cell; and (2) supplying a second verify potential to the gate of the reference cell which is different from the first verify potential. Because cell current is a very strong function of the gate voltage, applying different gate voltages to the memory and reference cells is equivalent to adjusting the sense ratio.

Abstract: A circuit for speeding up the pre-programming of floating gate storage transistors such as FLASH EPROMS, and particularly speeding up the pre-programming of a block or array of floating gate storage transistors includes a controllable voltage source that supplies gate programming potential across the control gate and source of the FLASH EPROM transistor cells to be programmed. A control circuit is provided that controls the voltage source to vary the gate programming potential during a programming interval as a function of time in order to decrease the time required for a given amount of charge movement to program the selected floating gate transistors. The wordline voltages are varied, while the source voltage is held constant. By starting at a lower wordline voltage, and increasing during the programming interval to a high wordline voltage, the programming speed is increased, and the high final turn-on threshold voltage for the programmed floating gate storage transistors is achieved.

Abstract: Contactless flash EPROM cell and array designs, and methods for fabricating the same result in a dense, segmentable flash EPROM chip. The flash EPROM cell is based on a drain-source-drain configuration, in which the single source diffusion is shared by two columns of transistors. The module includes a memory array having at least M rows and 2N columns of flash EPROM cells. M word lines, each coupled to the flash EPROM cells in one of the M rows of the flash EPROM cells, and N global bit lines are included. Data in and out circuitry is coupled to the N global bit lines which provide for reading and writing data in the memory array. Selector circuitry, coupled to the 2N columns of flash EPROM cells, and to the N global bit lines, provides for selective connection of two columns of the 2N columns to each of the N global bit lines so that access to the 2N columns of flash EPROM cells by the data in and out circuitry is provided across N global bit lines.

Abstract: For non-volatile memory devices, such as flash EPROM integrated circuits, which have memory cells and reference cells, and sense circuitry responsive to addressed memory cells and the reference cells, and in which a read potential is supplied to the gate of the selected memory cells and a reference potential is supplied to the gate of a reference memory cell during a read mode, the state of the programmable memory cells is verified by (1) supplying a first verify potential to the gate of an address programmable memory cell; and (2) supplying a second verify potential to the gate of the reference cell which is different from the first verify potential. Because cell current is a very strong function of the gate voltage, applying different gate voltages to the memory and reference cells is equivalent to adjusting the sense ratio.

Abstract: An improved contactless EPROM array, EPROM cell design, and method for fabricating the same is based on a unique drain-source-drain configuration, in which a single source diffusion is shared by two columns of transistors. An elongated first drain diffusion region, an elongated source diffusion region, and an elongated second drain diffusion region, are formed in a semi-conductor substrate along essentially parallel lines. Field oxide regions are grown on opposite sides of the first and second drain diffusion regions. Floating gates and control gate wordlines are formed orthogonal to the drain-source-drain structure to establish two columns of storage cells having a shared source region. The shared source region is coupled through a bottom block select transistor to a virtual ground terminal. Each drain diffusion region is coupled through a top block select transistor to global bitline.

Abstract: A voltage detection circuit for preventing the erasing and programming of a nonvolatile memory device during power up and power down sequences. A power source is coupled to the high voltage input and the low voltage input to provide a reference voltage in response to the greater of the high voltage input or the low voltage input. A low voltage detector is coupled to the low voltage input and the reference voltage and has circuitry to provide a first not-ready signal when the voltage on the low voltage input falls below a predetermined low voltage threshold. A high voltage detector is coupled to the high voltage input, the reference voltage, and the output of the low voltage detector and has circuitry to provide a second not-ready signal when either the first not-ready signal is received or the voltage on the high voltage input falls below a predetermined high voltage threshold. The not-ready signals prevent erasing or programming operations to occur in the nonvolatile memory device.