Abstract: A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the alignment layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.

Abstract: An apparatus for producing rectangular seeds for use in semiconductor or solar material manufacturing includes a template having a top surface and parallel slots, and an adhesive layer connected to the top surface of the template. The adhesive layer includes alignment lines aligned with the parallel slots. The apparatus also includes quarter sections made of a semiconductor or solar material and connected to the alignment layer. An interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines. A wire web is adapted to slice through the interface of each quarter section to separate the rectangular seed portions from the curved wing portions to produce rectangular seeds.

Abstract: A process for detecting mechanical and mechanochemical defects in the surface or edge of a silicon wafer resulting from a wafer manufacturing process. The present process comprises treating a surface of the silicon wafer with an aqueous etch solution comprising hydrofluoric acid and an oxidizing agent, followed by optical inspection of the treated wafer surface prior to subjecting that surface to conventional mechanical or mechanochemical polishing. The present process affords the means by which to more efficient identify wafers having such defects, thus reducing wafer manufacturing time and cost.