Patents by Inventor Tom DU

Tom DU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKED INTERCONNECT STRUCTURE WITH REDUCED CROSS COUPLED NOISE
    Publication number: 20190043796
    Abstract: An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.
    Type: Application
    Filed: June 25, 2018
    Publication date: February 7, 2019
    Inventors: Zhen ZHOU, Jun LIAO, Xiang LI, Kevin STONE, Tom DU, Tae-Young YANG, Ling ZHENG, James A. McCALL