Abstract: An optoelectronic device has a bright detector and a dark detector and reduces noise in the output of the bright detector using the output of the dark detector.

Abstract: An optoelectronic device has a bright detector and a dark detector and reduces noise in the output of the bright detector using the output of the dark detector.

Abstract: A method of integrating a topside optical device, having electrical contacts on a top side, with an electronic chip having electrical contacts on a connection side, involves creating a trench, defined by a wall, from the top side of a wafer containing the topside optical device into a substrate of the wafer, making a portion of the wall conductive by applying a conductive material to the portion; and thinning the substrate to expose the conductive material.

Abstract: A method of ensuring proper alignment between one optical device bearing unit and another optical device bearing unit involves creating a set of precisely placed and sized features for the one optical device bearing unit, creating a set of precisely placed and sized features for the other optical device bearing unit, the features being of a complementary pattern to enable the optical device bearing units to mate such that they are properly aligned with each other. An optical device unit is also described. The unit has multiple optical components, and a set of features sized and positioned to mate with complementary features of a different optical device unit so that when the units are brought together, the set of features and complementary features will ensure that the units are properly aligned with respect to each other.

Abstract: A method of integrating a topside optical device, having electrical contacts on a top side, with an electronic chip having electrical contacts on a connection side, involves creating a trench, defined by a wall, from the top side of a wafer containing the topside optical device into a substrate of the wafer, making a portion of the wall conductive by applying a conductive material to the portion; and thinning the substrate to expose the conductive material.

Abstract: A device integration method involves attaching two components together using a first material having a first melting point, then creating a unit by attaching the two components to a third component, using a second material having a second melting point lower than the first melting point, and then attaching the unit to another component, using a third material, having a third melting point lower than the second melting point. A device having multiple components attached together using a process described herein.