Abstract: A connector system for Behind-The-Ear (BTE) hearing devices provides a means to detachably connect a plurality of earhooks, which earhooks include special earhooks providing auxiliary functions. The connector system includes a coaxial connector mounted on the BTE device, which coaxial connector provides both an earhook mounting fixture, and an electrical connector for auxiliary functions. The auxiliary functions include a telecoil, an auxiliary microphone positioned proximal to an ear canal, an FM receiver, and an input jack for miscellaneous devices. The earhook mounting fixture also accepts standard off-the-shelf earhooks. A friction fit is provided between the earhook and the BTE device so that the angular position of the earhook may be adjusted for a comfortable fit.

Abstract: A connector system for Behind-The-Ear (BTE) hearing devices provides a means to detachably connect a plurality of earhooks, which earhooks include special earhooks providing auxiliary functions. The connector system includes a coaxial connector mounted on the BTE device, which coaxial connector provides both an earhook mounting fixture, and an electrical connector for auxiliary functions. The auxiliary functions include a telecoil, an auxiliary microphone positioned proximal to an ear canal, an FM receiver, and an input jack for miscellaneous devices. The earhook mounting fixture also accepts standard off-the-shelf earhooks. A friction fit is provided between the earhook and the BTE device so that the angular position of the earhook may be adjusted for a comfortable fit.

Abstract: An improved method for securing an external device of a implantable system, in cooperation with an implantable device of the implantable system, uses a medical-pressure-sensitive adhesive pad to attach the external device to skin. Both power and control signals may be transmitted transcutaneously from the external device to the implantable device. Efficient transmission of these signals requires that the external device be securely held in cooperation with the implantable device. The medical-pressure-sensitive adhesive pad acts as an interposing adhesive between the external device and the skin. One side of the pad provides adhesion to the back of the external device. The opposite side of the pad provides adhesion to the skin/hair. The pad includes a tab for easy removal of the pad from the external device. The adhesives have aggressive adhesion to the pad, so that upon the removal of the pad from the skin, and then the external device, all of the adhesive remains on the pad.

Abstract: An implantable medical device is made from an electronic subassembly hermetically sealed in a ceramic case filled with a potting material. Use of the potting material enhances the capacity of the device to withstand mechanical shock without failure. The device includes a hollow ceramic or other case having an open end to which a metal ring is hermetically bonded. The inside surface of the ceramic case is treated (cleansed and activated) to assure the potting material adheres to it. The potting material, while in a non-cured fluid or quasi-fluid state, is inserted inside of the ceramic case. The electronic circuitry is next inserted into the open end of the ceramic case while the potting material is still in a non-cured, soft or fluid state. The electronic circuitry displaces some of the potting material and the potting material fills the voids between the electronic circuitry and the ceramic case.

Abstract: An implantable medical device is made from an electronic subassembly hermetically sealed in a ceramic case filled with a potting material. Use of the potting material enhances the capacity of the device to withstand mechanical shock without failure. The device includes a hollow ceramic or other case having an open end to which a metal ring is hermetically bonded. The inside surface of the ceramic case is treated (cleansed and activated) to assure the potting material adheres to it. The potting material, while in a non-cured fluid or quasi-fluid state, is inserted inside of the ceramic case. The electronic circuitry is next inserted into the open end of the ceramic case while the potting material is still in a non-cured, soft or fluid state. The electronic circuitry displaces some of the potting material and the potting material fills the voids between the electronic circuitry and the ceramic case.