Patents by Inventor Tom J. Ley

Tom J. Ley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109031
    Abstract: The present disclosure provides a system for processing ultramafic material. The system may comprise a reactor for accelerating weathering of said ultramafic material. The reactor may comprise one or more chambers comprising one or more microbes, biological medicators, or enzymatic accelerants to facilitate the weathering of the ultramafic material.
    Type: Application
    Filed: April 19, 2023
    Publication date: April 4, 2024
    Inventors: Stephen J. ROMANIELLO, Brian D. LEY, Douglas O. EDWARDS, Margaret G. ANDREWS, Nathan G. WALWORTH, Thomas ISHOEY, Tom C. GREEN, Francesc MONTSERRAT, Martin VAN DEN BERGHE, Kenneth NEALSON, Devon Barnes COLE, Kelly ERHART
  • Publication number: 20130258619
    Abstract: Various circuit boards and stiffener frames and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a stiffener frame that has a surface adapted to engage a side of a circuit board. The surface includes a projection to protect a corner of the circuit board.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Inventors: Tom J. Ley, Eric S. Tosaya, Chia-Ken Leong
  • Patent number: 6512675
    Abstract: An intregrated circuit package, which has an intregrated circuit die thereto, is mounted to a system board. The ground trace of the system board is connected to the package, which has a pluality of ground leads on its surface. An electrically conductive epoxy is placed on the ground leads and adheres the package lid to the package board and ground the package lid. A heat sink is mounted to the package lid with an electrically conductive adhesive or electrically conductive slips that extend from a flange of the package lid to a flange of the heat sink to ground the heat sink.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: January 28, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Thomas S. Tarter, Eric S. Tosaya, Tom J. Ley, Shrikar Bhagath, Nhon T. Do