Abstract: The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins.

Abstract: The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins.

Abstract: The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins.

Abstract: Various data protection techniques are provided. In one embodiment, a memory device is provided. The memory device may initiate a security measure upon occurrence of one or more triggering events. The one or more triggering events may include receipt of a command signal. Various additional methods, devices, and systems are also provided.

Abstract: Various data protection techniques are provided. In one embodiment, a memory device is provided. The memory device may initiate a security measure upon occurrence of one or more triggering events. The one or more triggering events may include receipt of a command signal. Various additional methods, devices, and systems are also provided.

Abstract: The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins.

Abstract: Various data protection techniques are provided. In one embodiment, a memory device is provided. The memory device may initiate a security measure upon occurrence of one or more triggering events. The one or more triggering events may include receipt of a command signal. Various additional methods, devices, and systems are also provided.

Abstract: The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins.

Abstract: Various data protection techniques are provided. In one embodiment, a memory device is provided. The memory device may initiate a security measure upon occurrence of one or more triggering events. The one or more triggering events may include receipt of a command signal. Various additional methods, devices, and systems are also provided.

Abstract: Various data protection techniques are provided. In one embodiment, a memory device is provided. The memory device may initiate a security measure upon occurrence of one or more triggering events. The one or more triggering events may include receipt of a command signal. Various additional methods, devices, and systems are also provided.

Abstract: Various data protection techniques are provided. In one embodiment, a method includes manufacturing a memory component of an electronic system. Manufacturing the memory component may include disposing a memory array on a substrate and coupling a control circuit to the memory array. The control circuit may be configured to selectively prevent access to data stored within the memory array upon removal of the memory component from the electronic system. Various additional methods, devices, and systems are also provided.

Abstract: Various data protection techniques are provided. In one embodiment, a method includes manufacturing a memory component of an electronic system. Manufacturing the memory component may include disposing a memory array on a substrate and coupling a control circuit to the memory array. The control circuit may be configured to selectively prevent access to data stored within the memory array upon removal of the memory component from the electronic system. Various additional methods, devices, and systems are also provided.

Abstract: A method for operating a memory device is disclosed. In one embodiment, the method includes receiving authorized operating parameters of the memory device and comparing sensed operational parameters to the authorized operating parameters. Access to data stored within the memory device may be prevented if the operational parameters are outside the authorized operating parameters. A memory device and method of manufacturing such a device are also provided.

Abstract: The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins.

Abstract: The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins.

Abstract: A secure memory device that is configured to prevent unauthorized access of data is disclosed. More specifically, a kill function logic device is capable of initiating security measures upon the occurrence of some event. The security measures may include disabling read access to the memory device, accelerated erasing of the memory device, or disabling of the memory device itself. Alternatively, a circuit may be configured to purge data stored in the memory device in an accelerated fashion.

Abstract: A method for operating a memory device is disclosed. In one embodiment, the method includes receiving authorized operating parameters of the memory device and comparing sensed operational parameters to the authorized operating parameters. Access to data stored within the memory device may be prevented if the operational parameters are outside the authorized operating parameters. A memory device and method of manufacturing such a device are also provided.

Abstract: A secure memory device that is configured to prevent unauthorized access of data is disclosed. More specifically, a kill function logic device is capable of initiating security measures upon the occurrence of some event. The security measures may include disabling read access to the memory device, accelerated erasing of the memory device, or disabling of the memory device itself. Alternatively, a circuit may be configured to purge data stored in the memory device in an accelerated fashion.