Patents by Inventor Tom Ku

Tom Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070207270
    Abstract: A method of soak type coating for a substrate being coated with coating liquid provides a pump to regulate velocity of gas being introduced into a container to control discharge velocity of the coating liquid in the first container so as to control velocity of the coating liquid separating from the substrate for obtaining better control of thickness of the coating layer on the substrate. Wherein, the gas introduced into the container is incapable of occurring chemical reaction with the coating liquid for obtaining preferable effect of coating.
    Type: Application
    Filed: March 3, 2006
    Publication date: September 6, 2007
    Inventor: Tom Ku
  • Publication number: 20070102103
    Abstract: A manufacturing method for a printing circuit uses an adhesive as a printing material to print a line pattern of a printing circuit on a carrier by means of printing, and then cause an adhesive to stick with a mother film with a release type metal to allow a part of the carrier with the adhesive to pull and attach itself with a metal film, and another part without the adhesive does not pull and attach itself with the metal film such that a metal line is formed on the carrier. The manufacturing method can simplify the manufacturing process of the printing circuit, the line fabrication is very fast, the production efficiency can be enhanced and the production cost is low.
    Type: Application
    Filed: November 7, 2005
    Publication date: May 10, 2007
    Inventor: Tom Ku
  • Publication number: 20060231194
    Abstract: A method for forming fine lines on a gas permeable and moisture absorptive material comprises the following steps: spreading a water-based resin layer on one face of a molding plate with a metallized pattern; covering a carrier made from a gas permeable and moisture absorptive material on the water-based resin layer; allowing the water contained in the water-based resin layer to be carried away; removing the molding plate after said water-based resin layer is harden to be a solidified resin layer and combined firmly with the carrier and the metallized pattern, the metallized pattern on said molding plate being then pulled out and attached to the solidified resin layer to cause the carrier to have the metallized pattern.
    Type: Application
    Filed: April 15, 2005
    Publication date: October 19, 2006
    Inventor: Tom Ku