Patents by Inventor Tom Kupiszewski

Tom Kupiszewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190069350
    Abstract: A layered heater system is provided, which includes an engineered substrate, a heater substrate disposed on the engineered substrate, a resistive element layer formed proximate the heater plate, and a protective layer formed on the resistive element layer. Terminal pads are formed over at least a portion of the resistive element layer and are exposed through the protective layer. The engineered substrate includes a plurality of walls which extend in a thickness direction of the engineered substrate and which have a thickness engineered for specific heat transfer requirement.
    Type: Application
    Filed: October 25, 2018
    Publication date: February 28, 2019
    Applicant: Watlow Electric Manufacturing Company
    Inventors: Mark Everly, Cal Swanson, Tom Kupiszewski, Kevin Ptasienski, Chris Lanham, Mike Stewart
  • Patent number: 10159114
    Abstract: A layered heater system is provided that includes an engineered substrate having an upper face sheet, a lower face sheet, and a core disposed between the upper face sheet and the lower face sheet. A dielectric layer is formed on at least one of the upper face sheet and the lower face sheet, a resistive element layer is formed on the dielectric layer, a protective layer is formed on the resistive element layer, and terminal pads are formed over at least a portion of the resistive element layer, wherein the terminal pads are exposed through the protective layer. In one form, the core defines a honeycomb structure, and in another, the core defines a frame structure having a plurality of support ribs.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: December 18, 2018
    Assignee: Watlow Electric Manufacturing Company
    Inventors: Mark Everly, Cal Swanson, Tom Kupiszewski, Kevin Ptasienski, Chris Lanham, Mike Stewart
  • Publication number: 20090236327
    Abstract: A layered heater system is provided that includes an engineered substrate having an upper face sheet, a lower face sheet, and a core disposed between the upper face sheet and the lower face sheet. A dielectric layer is formed on at least one of the upper face sheet and the lower face sheet, a resistive element layer is formed on the dielectric layer, a protective layer is formed on the resistive element layer, and terminal pads are formed over at least a portion of the resistive element layer, wherein the terminal pads are exposed through the protective layer. In one form, the core defines a honeycomb structure, and in another, the core defines a frame structure having a plurality of support ribs.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 24, 2009
    Applicant: Watlow Electric Manufacturing Company
    Inventors: Mark Everly, Cal Swanson, Tom Kupiszewski, Kevin Ptasienski, Chris Lanham, Mike Stewart