Abstract: A current limit circuit regulates the current flow through a power switch 90 by measuring the current through the switch 90 and comparing it to a reference voltage VREF that represents the limit current. When the current through the power switch 90 is greater than the limit current, the current in the power switch 90 is pulled lower by a driver circuit 92 which controls the power switch 90. By using a current limit reference voltage that has two levels, the power switch 90 has two current limit thresholds. Using a comparator 94 to compare the input voltage of the power switch 90 to the output voltage of the power switch 90, an output signal is generated to control the current limit threshold. When the input voltage and output voltage has a large differential voltage, a lower current limit threshold voltage is selected. When the input voltage and output voltage has a small differential voltage, an upper limit threshold voltage is selected.

Abstract: A current limit circuit regulates the current flow through a power switch 90 by measuring the current through the switch 90 and comparing it to a reference voltage VREF that represents the limit current. When the current through the power switch 90 is greater than the limit current, the current in the power switch 90 is pulled lower by a driver circuit 92 which controls the power switch 90. By using a current limit reference voltage that has two levels, the power switch 90 has two current limit thresholds. Using a comparator 94 to compare the input voltage of the power switch 90 to the output voltage of the power switch 90, an output signal is generated to control the current limit threshold. When the input voltage and output voltage has a large differential voltage, a lower current limit threshold voltage is selected. When the input voltage and output voltage has a small differential voltage, an upper limit threshold voltage is selected.

Abstract: A multi-component electronic assembly (100) including a leadframe (101) having upper and lower surfaces and a plurality of conductive leads (203). Each lead (203) has first bonding surfaces (201) on the upper surface of each lead and second bonding surfaces (201) on the lower surface of each lead (203). Preferably, each lead has a plurality of third bonding surfaces (202) formed on at least some of the plurality of leads where the third bonding surfaces (202) are formed by conductive extensions of the leads (203) that extend towards the center of the assembly (100). A first passive component (102) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (104) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (202) are used, a third component (103) is electrically and mechanically coupled to the third bonding surfaces (202).

Abstract: A multi-component electronic assembly (100) including a leadframe (101) having upper and lower surfaces and a plurality of conductive leads (203). Each lead (203) has first bonding surfaces (201) on the upper surface of each lead and second bonding surfaces (201) on the lower surface of each lead (203). Preferably, each lead has a plurality of third bonding surfaces (202) formed on at least some of the plurality of leads where the third bonding surfaces (202) are formed by conductive extensions of the leads (203) that extend towards the center of the assembly (100). A first passive component (102) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (104) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (202) are used, a third component (103) is electrically and mechanically coupled to the third bonding surfaces (202).