Abstract: An improved technique for the manufacture of capacitive touch switch panel assemblies, utilized to control appliances and the like, provides simplified construction and manufacture. The technique involves the formation of conductive touch pads on one major surface of a dielectric panel and the formation of pairs of spaced-apart conductive pads and conductive lead members to the conductive pads on a separate flexible synthetic resin sheet. The synthetic resin is bonded to the opposite major surface of the dielectric panel with each pair of conductive pads on the synthetic resin sheet in registry with a corresponding touch pad on the one major surface of the dielectric panel. The synthetic resin sheet includes a portion having a conductive lead pattern formed thereon which is not bonded to the dielectric panel; this portion serves as a flexible connector for connection of the touch panel to a circuit board or the like.

Abstract: An improved technique for the manufacture of capacitive touch switch panel assemblies, utilized to control appliances and the like, provides simplified construction and manufacture. The technique involves the formation of conductive touch pads on one major surface of a dielectric panel and the formation of pairs of spaced-apart conductive pads and conductive lead members to the conductive pads on a separate flexible synthetic resin sheet. The synthetic resin is bonded to the opposite major surface of the dielectric panel with each pair of conductive pads on the synthetic resin sheet in registry with a corresponding touch pad on the one major surface of the dielectric panel. The synthetic resin sheet includes a portion having a conductive lead pattern formed thereon which is not bonded to the dielectric panel; this portion serves as a flexible connector for connection of the touch panel to a circuit board or the like.