Patents by Inventor Tom L. Todd

Tom L. Todd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact
    Patent number: 6436735
    Abstract: A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: August 20, 2002
    Assignee: Alpine Microsystems, Inc.
    Inventors: Martin P. Goetz, Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Tom L. Todd, Sam Beal
  • Circuit interconnect providing reduced crosstalk and simultaneous switching noise
    Publication number: 20010013650
    Abstract: Provided is a mount for an integrated circuit that features a routing carrier having first and second power planes and first and second signal layers. The first and second signal layers are disposed between the first and second power planes so that the return path for current propagating along the signal layers is in one of the adjacent power planes. To that end, another embodiment of the present invention provides that the distances between the signal layers and power planes are substantially constant over the volume of the routing carrier to ensure, which provides a constant impedance between one of the first and second signal layers and the power plane adjacent thereto.
    Type: Application
    Filed: December 20, 2000
    Publication date: August 16, 2001
    Inventors: Martin P. Goetz, Sammy K. Brown, George Avery, Andrew Wiggin, Tom L. Todd, Sam Beal
  • System and method for packaging integrated circuits
    Patent number: 6175161
    Abstract: A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: January 16, 2001
    Assignee: Alpine Microsystems, Inc.
    Inventors: Martin P. Goetz, Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Tom L. Todd, Sam Beal
  • Three dimensional mounting assembly for integrated circuits
    Patent number: 6128201
    Abstract: A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system. In one embodiment of the system of the present invention, a plurality of carriers corresponds to a plurality of ICs, and a board has a plurality of board regions for receiving the plurality of ICs and are arranged so as to be attached to a backplane forming a vertical stack of boards.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: October 3, 2000
    Assignee: Alpine Microsystems, Inc.
    Inventors: Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Tom L. Todd, Sam Beal