Patents by Inventor Tom Peters
Tom Peters has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240234761Abstract: Disclosed herein are aspects of methods to control airflow to a fuel cell stack and a cooling fan within a housing by fluidly connecting a predetermined minimum volume of airflow through the housing to the fan and a series of louvres, adjustable apertures, and bypass valves dynamically adjust the air flow to at least one of one of the fuel cell stack and fan providing the required minimum volume of fluid to the fan during different controller based modes of operation.Type: ApplicationFiled: May 20, 2022Publication date: July 11, 2024Applicant: Intelligent Energy LimitedInventors: Tom Peter HOOD, Harry John KARMAZYN, Jesse Thomas Robin Dufton
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Publication number: 20240136552Abstract: Disclosed herein are aspects of methods to control airflow to a fuel cell stack and a cooling fan within a housing by fluidly connecting a predetermined minimum volume of airflow through the housing to the fan and a series of louvres, adjustable apertures, and bypass valves dynamically adjust the air flow to at least one of one of the fuel cell stack and fan providing the required minimum volume of fluid to the fan during different controller based modes of operation.Type: ApplicationFiled: May 19, 2022Publication date: April 25, 2024Applicant: Intelligent Energy LimitedInventors: Tom Peter HOOD, Harry John KARMAZYN, Jesse Thomas Robin Dufton
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Publication number: 20230204063Abstract: Methods and devices for providing a threaded male member for a fastening arrangement are disclosed. The threaded male member can include at least one reaction portion at or towards at least one respective end of the threaded male member for use in reacting applied torque during tightening or releasing an associated nut of the fastening arrangement. The at least one reaction portion can be a permanent feature of the threaded male member and can remain part of the threaded male member after said tightening to a target torque.Type: ApplicationFiled: February 27, 2023Publication date: June 29, 2023Applicant: Engentus Pty LtdInventors: Brian Eric BRADSHAW, Tom Peter BASKOVICH, Sam William TURNBULL
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Patent number: 11649846Abstract: A segmented nut has inner segments and an outer sleeve. Part of the sleeve interface portion and part of the segment interface portion engage when the sleeve rotates relative to the inner nut during release of the segmented nut with part of the segment interface portion at a greater distance from a central axis of the segmented nut than a minimum distance of the at least part of the sleeve interface portion from the central axis. One or more of the segments can include a retainer preventing the sleeve moving toward a free face of the segment(s). One or more of the segments can have a flange portion providing an increased working (compression) face relative to a plain segmented nut. An assembled segmented nut can include some radial freeplay for the segments to move radially whilst being retained within the sleeve prior to application of the segmented nut to a threaded bolt, stud or rod such that threading of the segmented nut onto the thread of the bolt, stud or rod removes the freeplay.Type: GrantFiled: March 27, 2019Date of Patent: May 16, 2023Assignee: Segnut Pty LtdInventors: Brian Eric Bradshaw, Tom Peter Baskovich, Sam William Turnbull
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Patent number: 11546126Abstract: Method and systems are provided for receiving and transmitting signals over a time division duplex communication path (the “Path”). Operations may include sending a first signal via an uplink portion of the Path, and receiving a second signal via a downlink portion of the Path. The Path operates over a first band having a first frequency range and during a communication time including an uplink period (TU) and a downlink period (TD). The uplink portion is sent during the uplink period, uses a first portion of the first frequency range and is disposed between a first uplink guard band portion and a second uplink guard band portion. The guard bands are allocated from a second portion and a third portion of the first band. The first band is disposed between a second band, providing a second communication path, and a third band providing an FDD communication path.Type: GrantFiled: June 29, 2021Date of Patent: January 3, 2023Assignee: DBSD CorporationInventors: Mariam Sorond, Peter Corea, Doug Hyslop, Tom Peters
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Patent number: 11431309Abstract: A method of controlling bandwidth and peaking over gain in a variable gain amplifier (VGA) device and structure therefor. The device includes at least three differential transistor pairs configured as a cross-coupled differential amplifier with differential input nodes, differential bias nodes, differential output nodes, a current source node, and two cross-coupling nodes. The cross-coupled differential amplifier includes a load resistor coupled to each of the differential output nodes and one of the cross-coupling nodes, and a load inductor coupled to the each of the cross-coupling nodes and a power supply rail. A current source is electrically coupled to the current source node. The cross-coupling configuration with the load resistance and inductance results in a lower bandwidth and lowered peaking at low gain compared to high gain. Further, the tap point into the inductor can be chosen as another variable to “tune” the bandwidth and peaking in a communication system.Type: GrantFiled: October 7, 2020Date of Patent: August 30, 2022Assignee: MARVELL ASIA PTE LTD.Inventor: Tom Peter Edward Broekaert
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Publication number: 20210336757Abstract: Method and systems are provided for receiving and transmitting signals over a time division duplex communication path (the “Path”). Operations may include sending a first signal via an uplink portion of the Path, and receiving a second signal via a downlink portion of the Path. The Path operates over a first band having a first frequency range and during a communication time including an uplink period (TU) and a downlink period (TD). The uplink portion is sent during the uplink period, uses a first portion of the first frequency range and is disposed between a first uplink guard band portion and a second uplink guard band portion. The guard bands are allocated from a second portion and a third portion of the first band. The first band is disposed between a second band, providing a second communication path, and a third band providing an FDD communication path.Type: ApplicationFiled: June 29, 2021Publication date: October 28, 2021Applicant: DBSD CorportaionInventors: Mariam Sorond, Peter Corea, Doug Hyslop, Tom Peters
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Patent number: 11153062Abstract: One or more embodiments of devices, systems and method are provided for receiving and transmitting signals over a time division duplex (TDD) communication path. Signals are received over the TDD communication path via a first portion of a first frequency band. A method may include sending a time division duplex (TDD) signal via an uplink portion of a TDD communication path and receiving a TDD signal via a downlink portion of the TDD communication path. The uplink portion arises over an uplink period and the downlink portion arises over a downlink period. The TDD communication path is disposed between and mutually exclusive of a broadcast communication path and an FDD communication path. The uplink portion of the TDD communication path is separated from the broadcast communication path by an uplink guard band. The downlink portion of the TDD communication path may be contiguous with the broadcast communication path.Type: GrantFiled: February 27, 2020Date of Patent: October 19, 2021Assignee: DBSD CorporationInventors: Mariam Sorond, Peter Corea, Doug Hyslop, Tom Peters
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Publication number: 20210021246Abstract: A method of controlling bandwidth and peaking over gain in a variable gain amplifier (VGA) device and structure therefor. The device includes at least three differential transistor pairs configured as a cross-coupled differential amplifier with differential input nodes, differential bias nodes, differential output nodes, a current source node, and two cross-coupling nodes. The cross-coupled differential amplifier includes a load resistor coupled to each of the differential output nodes and one of the cross-coupling nodes, and a load inductor coupled to the each of the cross-coupling nodes and a power supply rail. A current source is electrically coupled to the current source node. The cross-coupling configuration with the load resistance and inductance results in a lower bandwidth and lowered peaking at low gain compared to high gain. Further, the tap point into the inductor can be chosen as another variable to “tune” the bandwidth and peaking in a communication system.Type: ApplicationFiled: October 7, 2020Publication date: January 21, 2021Inventor: Tom Peter Edward BROEKAERT
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Patent number: 10840857Abstract: A transimpedance amplifier (TIA) device. The device includes a photodiode coupled to a differential TIA with a first and second TIA, which is followed by a Level Shifting/Differential Amplifier (LS/DA). The photodiode is coupled between a first and a second input terminal of the first and second TIAs, respectively. The LS/DA can be coupled to a first and second output terminal of the first and second TIAs, respectively. The TIA device includes a semiconductor substrate comprising a plurality of CMOS cells, which can be configured using 28 nm process technology to the first and second TIAs. Each of the CMOS cells can include a deep n-type well region. The second TIA can be configured using a plurality CMOS cells such that the second input terminal is operable at any positive voltage level with respect to an applied voltage to a deep n-well for each of the plurality of second CMOS cells.Type: GrantFiled: March 11, 2019Date of Patent: November 17, 2020Assignee: INPHI CORPORATIONInventors: Rahul Shringarpure, Tom Peter Edward Broekaert, Gaurav Mahajan
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Patent number: 10833643Abstract: A method of controlling bandwidth and peaking over gain in a variable gain amplifier (VGA) device and structure therefor. The device includes at least three differential transistor pairs configured as a cross-coupled differential amplifier with differential input nodes, differential bias nodes, differential output nodes, a current source node, and two cross-coupling nodes. The cross-coupled differential amplifier includes a load resistor coupled to each of the differential output nodes and one of the cross-coupling nodes, and a load inductor coupled to the each of the cross-coupling nodes and a power supply rail. A current source is electrically coupled to the current source node. The cross-coupling configuration with the load resistance and inductance results in a lower bandwidth and lowered peaking at low gain compared to high gain. Further, the tap point into the inductor can be chosen as another variable to “tune” the bandwidth and peaking in a communication system.Type: GrantFiled: December 21, 2018Date of Patent: November 10, 2020Assignee: INPHI CORPORATIONInventor: Tom Peter Edward Broekaert
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Publication number: 20200195411Abstract: One or more embodiments of devices, systems and method are provided for receiving and transmitting signals over a time division duplex (TDD) communication path. Signals are received over the TDD communication path via a first portion of a first frequency band. A method may include sending a time division duplex (TDD) signal via an uplink portion of a TDD communication path and receiving a TDD signal via a downlink portion of the TDD communication path. The uplink portion arises over an uplink period and the downlink portion arises over a downlink period. The TDD communication path is disposed between and mutually exclusive of a broadcast communication path and an FDD communication path. The uplink portion of the TDD communication path is separated from the broadcast communication path by an uplink guard band. The downlink portion of the TDD communication path may be contiguous with the broadcast communication path.Type: ApplicationFiled: February 27, 2020Publication date: June 18, 2020Inventors: Mariam Sorond, Peter Corea, Doug Hyslop, Tom Peters
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Patent number: 10434920Abstract: A footrest assembly is provided for a motor vehicle. That footrest assembly includes a footrest, a wiring shield and a foam body sandwiched between the footrest and the wiring shield.Type: GrantFiled: May 18, 2016Date of Patent: October 8, 2019Assignee: Ford Global Technologies, LLCInventors: Robert Patrick Barren, Tom Peter Goffas, William Charles Bauer, Bryn Arthur Davies
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Publication number: 20190234445Abstract: A segmented nut has inner segments and an outer sleeve. Part of the sleeve interface portion and part of the segment interface portion engage when the sleeve rotates relative to the inner nut during release of the segmented nut with part of the segment interface portion at a greater distance from a central axis of the segmented nut than a minimum distance of the at least part of the sleeve interface portion from the central axis. One or more of the segments can include a retainer preventing the sleeve moving toward a free face of the segment(s). One or more of the segments can have a flange portion providing an increased working (compression) face relative to a plain segmented nut. An assembled segmented nut can include some radial freeplay for the segments to move radially whilst being retained within the sleeve prior to application of the segmented nut to a threaded bolt, stud or rod such that threading of the segmented nut onto the thread of the bolt, stud or rod removes the freeplay.Type: ApplicationFiled: March 27, 2019Publication date: August 1, 2019Applicant: SEGNUT PTY LTDInventors: Brian Eric BRADSHAW, Tom Peter BASKOVICH, Sam William TURNBULL
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Publication number: 20190207568Abstract: A transimpedance amplifier (TIA) device. The device includes a photodiode coupled to a differential TIA with a first and second TIA, which is followed by a Level Shifting/Differential Amplifier (LS/DA). The photodiode is coupled between a first and a second input terminal of the first and second TIAs, respectively. The LS/DA can be coupled to a first and second output terminal of the first and second TIAs, respectively. The TIA device includes a semiconductor substrate comprising a plurality of CMOS cells, which can be configured using 28 nm process technology to the first and second TIAs. Each of the CMOS cells can include a deep n-type well region. The second TIA can be configured using a plurality CMOS cells such that the second input terminal is operable at any positive voltage level with respect to an applied voltage to a deep n-well for each of the plurality of second CMOS cells.Type: ApplicationFiled: March 11, 2019Publication date: July 4, 2019Inventors: Rahul SHRINGARPURE, Tom Peter Edward BROEKAERT, Gaurav MAHAJAN
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Patent number: 10270403Abstract: A transimpedance amplifier (TIA) device. The device includes a photodiode coupled to a differential TIA with a first and second TIA, which is followed by a Level Shifting/Differential Amplifier (LS/DA). The photodiode is coupled between a first and a second input terminal of the first and second TIAs, respectively. The LS/DA can be coupled to a first and second output terminal of the first and second TIAs, respectively. The TIA device includes a semiconductor substrate comprising a plurality of CMOS cells, which can be configured using 28 nm process technology to the first and second TIAs. Each of the CMOS cells can include a deep n-type well region. The second TIA can be configured using a plurality CMOS cells such that the second input terminal is operable at any positive voltage level with respect to an applied voltage to a deep n-well for each of the plurality of second CMOS cells.Type: GrantFiled: September 19, 2017Date of Patent: April 23, 2019Assignee: INPHI CORPORATIONInventors: Rahul Shringarpure, Tom Peter Edward Broekaert, Gaurav Mahajan
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Patent number: 10263756Abstract: A method according to an embodiment of the invention includes receiving and transmitting signals over a time division duplex (TDD) communication path. Signals are sent over the TDD communication path via a first portion and are received via a second portion of a first frequency band, wherein the first portion uses a smaller spectrum bandwidth than the second portion. The first frequency band is adjacent to a second frequency band and to a third frequency band. The second frequency band includes a first temporally-asymmetric TDD communication path having a third portion and a fourth portion. The third frequency band includes a second temporally-asymmetric TDD communication path having a fifth portion and a sixth portion.Type: GrantFiled: July 4, 2017Date of Patent: April 16, 2019Assignee: DISH Network CorporationInventors: Mariam Sorond, Peter Corea, Doug Hyslop, Tom Peters
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Publication number: 20190058571Abstract: Methods and apparatuses are described for allocating transmission and reception times arising over three time division duplex communication paths, where the transmission and reception times for each path are asynchronous with respect to each of the other paths, and wherein guard bands are utilized between disposing signal paths, where such paths overlap during a given time span.Type: ApplicationFiled: October 21, 2018Publication date: February 21, 2019Inventors: Mariam Sorond, Peter Corea, Doug Hyslop, Tom Peters
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Patent number: 10148361Abstract: The present invention is directed to data communication system and methods. More specifically, various embodiments of the present invention provide a communication interface that is configured to transfer data at high bandwidth using PAM format(s) over optical communication networks. In various embodiments, amplitude and phase of the optical wave are modulated. There are other embodiments as well.Type: GrantFiled: January 17, 2018Date of Patent: December 4, 2018Assignee: INPHI CORPORATIONInventors: Tom Peter Edward Broekaert, Hari Shankar
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Patent number: 10116263Abstract: A transimpedance amplifier (TIA) device and method of operation therefor. The TIA device can include a semiconductor substrate, a TIA with an input and output configured on the semiconductor substrate, and an overload buffer module coupled to the input terminal of the TIA. The overload buffer module can include a variable current source having an input and an output, and a biased buffer diode coupled to the output of the variable current source and to a ground node. The method of operation can include replicating, by the overload buffer module, the current-voltage (I/V) characteristics of the DC input signal at the output of the overload buffer module, wherein the overload buffer module reduces a total harmonic distortion (THD) of a DC output signal from the output of the TIA.Type: GrantFiled: May 16, 2017Date of Patent: October 30, 2018Assignee: INPHI CORPORATIONInventor: Tom Peter Edward Broekaert