Patents by Inventor Tom Pitten

Tom Pitten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250063662
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Application
    Filed: November 7, 2024
    Publication date: February 20, 2025
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Mark W. Gailus, Tom Pitten, Donald A. Girard, JR., Huilin Ren
  • Patent number: 12184012
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: December 31, 2024
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Patent number: 12171063
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: December 17, 2024
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, Tom Pitten, Donald A. Girard, Jr., Huilin Ren
  • Publication number: 20240030660
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: June 15, 2023
    Publication date: January 25, 2024
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20230371178
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 16, 2023
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Mark W. Gailus, Tom Pitten, Donald A. Girard, JR., Huilin Ren
  • Patent number: 11758656
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: September 12, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, Tom Pitten, Donald A. Girard, Jr., Huilin Ren
  • Patent number: 11715914
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: August 1, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20210359450
    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Application
    Filed: July 30, 2021
    Publication date: November 18, 2021
    Applicant: Amphenol Corporation
    Inventors: Donald A. Girard, JR., Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine
  • Publication number: 20210315102
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Application
    Filed: June 15, 2021
    Publication date: October 7, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Mark W. Gailus, Tom Pitten, Donald A. Girard, JR., Huilin Ren
  • Patent number: 11108180
    Abstract: Electrical connectors including superelastic components. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. A connector can include one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members may deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: August 31, 2021
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine
  • Patent number: 11057995
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: July 6, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, Tom Pitten, Donald A. Girard, Jr., Huilin Ren
  • Publication number: 20210175670
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: November 23, 2020
    Publication date: June 10, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Patent number: 10847937
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: November 24, 2020
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20200350718
    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Application
    Filed: July 20, 2020
    Publication date: November 5, 2020
    Applicant: Amphenol Corporation
    Inventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine, Donald A. Girard
  • Patent number: 10720724
    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: July 21, 2020
    Assignee: Amphenol Corporation
    Inventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine, Donald A. Girard, Jr.
  • Publication number: 20190380204
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Application
    Filed: June 10, 2019
    Publication date: December 12, 2019
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Mark W. Gailus, Tom Pitten, Donald A. Girard, JR., Huilin Ren
  • Publication number: 20190334292
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: July 8, 2019
    Publication date: October 31, 2019
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20190260147
    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Application
    Filed: May 2, 2019
    Publication date: August 22, 2019
    Applicant: Amphenol Corporation
    Inventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine, Donald A. Girard, JR.
  • Patent number: 10367287
    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: July 30, 2019
    Assignee: Amphenol Corporation
    Inventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine, Donald A. Girard, Jr.
  • Patent number: 10348040
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: July 9, 2019
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder