Abstract: A method and device for manufacturing a smart card inlay includes attaching a first and a second end of a single wire antenna to a single first substrate, fixing the wire antenna, aside from the first and second ends thereof, to a second substrate. The method further includes thereafter relocating the first substrate relative to the second substrate such that the first and second ends of the wire antenna are at locations on the second substrate suitable for connection to a chip module, thereafter connecting the first end and the second end to the chip module, and thereafter removing the first substrate.

Abstract: A method for manufacture of a contactless smart card device including mounting at least one antenna and at least one smart card module onto a substrate layer, placing aramagnetic material over at least part of the at least one antenna, and laminating the substrate layer and the paramagnetic material to provide a laminate.

Abstract: A method for manufacture of a contactless smart card device including mounting at least one antenna and at least one smart card module onto a substrate layer, placing aramagnetic material over at least part of the at least one antenna, and laminating the substrate layer and the paramagnetic material to provide a laminate.

Abstract: A method for manufacture of a contactless smart card device including mounting at least one antenna and at least one smart card module onto a substrate layer, placing paramagnetic material over at least part of the at least one antenna, and laminating the substrate layer and the paramagnetic material to provide a laminate.

Abstract: A method for manufacture of a contactless smart card device including mounting at least one antenna and at least one smart card module onto a substrate layer, placing paramagnetic material over at least part of the at least one antenna, and laminating the substrate layer and the paramagnetic material to provide a laminate.

Abstract: Methods for manufacturing a smart card inlay. In a first embodiment, the method includes initially connecting a first end (106) of a wire antenna (108) to a chip module (104) mounted in an aperture (102) on a substrate (100), thereafter fixing the wire antenna (108) onto the substrate (100) and thereafter connecting a second end (112) of the wire antenna (108) to the chip module (104). In a second embodiment, the method includes providing a wire antenna having a first end (200) and a second end (202), wherein the first end (200) and the second end (202) are connected to a chip module (206) and do not extend past the chip module (206) and fixing the wire antenna (204) to a substrate (208).