Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit.

Abstract: A process to make a connector is enclosed. The claimed embodiment comprises the following steps. First, design an insulating substrate using a customer specification. Second, program a Computer Numerical Control machine tool to form holes in the insulating substrate according to the design made in step one. Third, program a computer controlled dispensing machine tool to dispense conductive polymer into each hole formed in step 2. Fourth, form holes in the insulating substrate using the programmed Computer Numerical Control machine tool. Fifth, place a pin in each hole. Sixth, using a computer controlled automated dispensing machine, dispense electrically conductive polymer into each hole around the pin. And, finally, cure the polymer to hold the pin in place.

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastomechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastomeric Memory Material. One embodiment includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastomeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastomeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. Another embodiment substitutes a metal plated through hole for the pin and uses elastomeric flex dots on both ends of the through hole.

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit.

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit.

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit.

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit.