Patents by Inventor Tom T. Nguyen
Tom T. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240025057Abstract: An example finger includes a finger body and a finger tip. The finger tip is configured to be removably mounted to the finger body. The finger includes a locking mechanism configured to secure or couple the finger tip to the finger body.Type: ApplicationFiled: August 18, 2021Publication date: January 25, 2024Inventors: Scott Alexander Stilson, Tom T. Nguyen, Nicolas Alexander Hall, Stephan Merkelbach, Kurt Wyatt Reinschmidt, Oscar Arturo Arellano Sevilla, Corey R. Shidler
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Publication number: 20230076756Abstract: An example device includes fingers that are adjustable longitudinally and configured to grip a workpiece. A clamping or locking mechanism can be used to secure the fingers at desired longitudinal positions. In examples, a retaining component is disposed through the fingers and is configured to retain the fingers in lateral directions.Type: ApplicationFiled: February 18, 2021Publication date: March 9, 2023Inventors: Scott Alexander Stilson, Tom T. Nguyen, Nicolas Alexander Hall, Stephan Merkelbach, Kurt Wyatt Reinschmidt, Oscar Arturo Arellano Sevilla, Corey R. Shidler
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Patent number: 10712182Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.Type: GrantFiled: April 25, 2018Date of Patent: July 14, 2020Assignee: DUNAN SENSING LLCInventor: Tom T Nguyen
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Patent number: 10168191Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.Type: GrantFiled: August 7, 2015Date of Patent: January 1, 2019Assignee: DUNAN SENSING LLCInventor: Tom T. Nguyen
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Patent number: 10094686Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.Type: GrantFiled: August 7, 2015Date of Patent: October 9, 2018Assignee: DUNAN SENSING LLCInventor: Tom T. Nguyen
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Publication number: 20180238720Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.Type: ApplicationFiled: April 25, 2018Publication date: August 23, 2018Inventor: TOM T NGUYEN
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Patent number: 10031039Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second, third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firType: GrantFiled: February 15, 2017Date of Patent: July 24, 2018Assignee: DUNAN SENSING LLCInventors: Tom T. Nguyen, Cuong D. Nguyen
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Publication number: 20170160155Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second, third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firType: ApplicationFiled: February 15, 2017Publication date: June 8, 2017Inventors: TOM T. NGUYEN, CUONG D. NGUYEN
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Patent number: 9625342Abstract: Apparatus having a hermetic seal that seals a portion of the apparatus, for example and without limitation, a portion having a MEMS sensor.Type: GrantFiled: January 31, 2014Date of Patent: April 18, 2017Assignee: DUNAN SENSING, LLCInventor: Tom T. Nguyen
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Patent number: 9593994Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firsType: GrantFiled: October 16, 2014Date of Patent: March 14, 2017Assignee: DUNAN SENSING, LLCInventors: Tom T. Nguyen, Cuong D. Nguyen
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Patent number: 9581468Abstract: Methods for fabricating a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.Type: GrantFiled: January 31, 2014Date of Patent: February 28, 2017Assignee: DUNAN SENSING, LLCInventor: Tom T. Nguyen
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Patent number: 9506829Abstract: Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support.Type: GrantFiled: June 20, 2014Date of Patent: November 29, 2016Assignee: DUNAN SENSING LLCInventors: Tom T. Nguyen, Cuong D. Nguyen
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Publication number: 20160109315Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firsType: ApplicationFiled: October 16, 2014Publication date: April 21, 2016Inventors: Tom T. Nguyen, Cuong D. Nguyen
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Publication number: 20150369684Abstract: Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support.Type: ApplicationFiled: June 20, 2014Publication date: December 24, 2015Inventors: Tom T. Nguyen, Cuong D. Nguyen
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Publication number: 20150343575Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.Type: ApplicationFiled: August 7, 2015Publication date: December 3, 2015Inventor: TOM T. NGUYEN
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Publication number: 20150346002Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.Type: ApplicationFiled: August 7, 2015Publication date: December 3, 2015Inventor: TOM T. NGUYEN
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Publication number: 20150219517Abstract: Apparatus having a hermetic seal that seals a portion of the apparatus, for example and without limitation, a portion having a MEMS sensor.Type: ApplicationFiled: January 31, 2014Publication date: August 6, 2015Applicant: Microlux Technology, Inc.Inventor: Tom T. Nguyen
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Publication number: 20150217416Abstract: Methods for fabricating a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.Type: ApplicationFiled: January 31, 2014Publication date: August 6, 2015Applicant: Microlux Technology, Inc.Inventor: Tom T. Nguyen
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Patent number: 7170306Abstract: One embodiment of the present invention is a method for fabricating a structure useful for testing circuits that includes steps of: (a) aligning a first side of a connector-holder comprised of electrical connectors having retractable ends that are extendable out of the first side of the connector-holder and having retractable ends that are extendable out of a second side of the connector-holder with a substrate; and (b) connecting ends extendable out of the first side to pads on the substrate to form the structure.Type: GrantFiled: March 12, 2003Date of Patent: January 30, 2007Assignee: Celerity Research, Inc.Inventors: Konstantine N. Karavakis, Tom T. Nguyen
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Patent number: 6998864Abstract: One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a flexible substrate having contactors on a first side and pads on a second side; (b) a rigid substrate having vias aligned with the pads on the second side of the flexible substrate; (c) an adhesive layer comprised of a compliant adhesive material having vias aligned with the pads on the second side of the flexible substrate; the adhesive layer being affixed to the flexible substrate and the rigid substrate; (d) a card; (e) electrical connectors that are retained in the vias of the rigid substrate and the adhesive layer, which electrical connectors have first and second retractable ends, wherein the first retractable ends contact pads on the substrate, and the second retractable ends contact pads on the card; and (f) a clamp that is adapted to fit over the substrate and the adhesive layer, the clamp having an opening to provide access to the contactors, wherein the clamp is connected to the card.Type: GrantFiled: June 28, 2005Date of Patent: February 14, 2006Assignee: Celerity Research, Inc.Inventors: Konstantine N. Karavakis, Tom T. Nguyen