Abstract: A system for the acquisition of biopotential signals, comprising at least a first electrode configured for detecting a biopotential signal within a signal bandwidth of interest and being connected to an impedance detection module that provides a first electrode voltage. The impedance detection module comprises a current generation circuit connected in parallel to an amplifier. The current generation circuit comprises an AC current generator configured to generate a first current signal through the first electrode. The first current signal has a frequency outside of the signal bandwidth of interest. The current generation circuit also comprising a capacitor connected between the input of the amplifier and the AC current generator so as to isolate the AC current generator from the amplifier input at the signal bandwidth of interest.

Abstract: A microprocessor configured to receive and process digitized signals derived from an analogue ECG signal is provided. An example microprocessor comprises a beat detection unit configured to receive the in-phase and quadrature phase band power signals, calculate a band power value and an adaptive threshold value, and compare said band power value with said adaptive threshold value to detect a QRS complex of the ECG signal indicative of a detected valid beat; and an R peak detection unit configured to receive the digital ECG signal and information about the detected valid beat, select a portion of the received ECG signal as a first time window around the detected valid beat; determine the location of a first R peak position; and perform a time domain search in a second time window around said first R peak position in order to refine the location of an R peak position.

Abstract: A probe for recording and/or stimulating brain activity includes a connecting portion and at least one shank extending from the connecting portion. The at least one shank includes a first side, a second side opposed to the first side, and a fin protruding substantially perpendicularly from the second side and running on at least a part of a length of the at least one shank. The first side includes at least one recording and/or stimulating site.

Abstract: The present invention provides a Vestibular Evoked Myogenic Potential monitoring system comprising an autonomous integrated system. The integrated system comprises an output being arranged for transferring a stimulation signal via an actuator to an equilibrium organ of a person, a processing and controlling block having an integrated radio and antenna, and an array of electrodes being attachable in the vicinity of at least one muscle of said person and being arranged for recording the responsive signal and for transferring this signal to the processing and controlling block. The processing and controlling block of the integrated system is arranged for generating a stimulus, for storing and processing the recorded signals, and for sending the processed data via a WL link to a processor.

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.