Abstract: A thermal insulation structure is disposed on an outer surface of a housing of an electronic device. The thermal insulation structure includes a plurality of tubular structures arranged in parallel, and each of the tubular structures extends along an extension direction. Each tubular structure has at least one tube wall enclosing to form a hollow space. Due to the tubular structures, the thermal isolation structure has anisotropic thermal conductivity. In the thermal isolation structure, heat transfer in every direction is different, and the hot spot area is relative enlarged to reduce the highest temperature on the surface of the thermal isolation structure. Thus, high temperature hot spot area caused by the heat generating element is prevented to be formed on the surface of the electronic device.

Abstract: A solid state relay is provided herein, which utilizes an electromagnetic coupling device for galvanic isolation and providing feedback from the output side to the system side. The solid state relay contains a system-side driving circuit, an electromagnetic coupling device, and an output-side control circuit. The electromagnetic coupling device contains at least a system-side electromagnetic coupling element, a first output-side electromagnetic coupling element, and a second output-side electromagnetic coupling element. The system-side driving circuit is connected to the system-side electromagnetic coupling element, and takes the ON/OFF digital control signals from a digital system as input to turn on and off its driving to the system-side electromagnetic coupling element.

Abstract: A solid state relay is provided herein, which utilizes an electromagnetic coupling device for galvanic isolation and providing feedback from the output side to the system side. The solid state relay contains a system-side driving circuit, an electromagnetic coupling device, and an output-side control circuit. The electromagnetic coupling device contains at least a system-side electromagnetic coupling element, a first output-side electromagnetic coupling element, and a second output-side electromagnetic coupling element. The system-side driving circuit is connected to the system-side electromagnetic coupling element, and takes the ON/OFF digital control signals from a digital system as input to turn on and off its driving to the system-side electromagnetic coupling element.

Abstract: An apparatus and method for recovering from soft errors in register files is disclosed. In one embodiment, an apparatus includes a register file and error-correcting-code generation logic. Each register in the register file has bits to store data and bits to store an error-correcting-code value for the data.

Abstract: In a semiconductor device encapsulation assembly (50; 60), a semiconductor device (21), preferably a pressure transducer, is mounted on a base (11) in a cavity (20) formed by the base and surrounding walls (15). Electrical connections, preferably wire bonds (27), connect the semiconductor device to conductor paths (28) on the base within the cavity. An encapsulation material comprising a thixotropic fluorosiloxane material (51; 61) is applied in the cavity and completely covers the semiconductor device and the electrical connections. This structure enables the semiconductor device to withstand typical automotive contaminants, such as mild acids and gasoline, while also preventing erratic semiconductor device operation due to bubbles which may be drawn into the encapsulation material.

Abstract: In a semiconductor device encapsulation assembly (50; 60), a semiconductor device (21), preferably a pressure transducer, is mounted on a base (11) in a cavity (20) formed by the base and surrounding walls (15). Electrical connections, preferably wire bonds (27), connect the semiconductor device to conductor paths (28) on the base within the cavity. An encapsulation material comprising a thixotropic fluorosiloxane material (51; 61) is applied in the cavity and completely covers the semiconductor device and the electrical connections. This structure enables the semiconductor device to withstand typical automotive contaminants, such as mild acids and gasoline, while also preventing erratic semiconductor device operation due to bubbles which may be drawn into the encapsulation material.