Patents by Inventor Tom Wang

Tom Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220398141
    Abstract: Techniques are disclosed for processing a workflow campaign. In some embodiments, a message processing service receives a first message that corresponds to a user arriving at a first node of the workflow campaign from a first message queue. The message processing service causes one or more actions associated with the first node to be performed with respect to the user. In addition, the message processing service determines that the first user should be progressed from the first node to a second node of the workflow campaign. The message processing service generates a second message that corresponds to the user arriving at the second node and determines a second message queue that is associated with the second node. The message processing service progresses the user from the first node to the second node by transmitting the second message to the second message queue.
    Type: Application
    Filed: June 14, 2022
    Publication date: December 15, 2022
    Inventors: Gregory Michael METHVIN, Thomas KIM, James CUMMINGS, Sean Edmund BURKE, Tse-Wen Tom WANG
  • Publication number: 20100246134
    Abstract: A thermal insulation structure is disposed on an outer surface of a housing of an electronic device. The thermal insulation structure includes a plurality of tubular structures arranged in parallel, and each of the tubular structures extends along an extension direction. Each tubular structure has at least one tube wall enclosing to form a hollow space. Due to the tubular structures, the thermal isolation structure has anisotropic thermal conductivity. In the thermal isolation structure, heat transfer in every direction is different, and the hot spot area is relative enlarged to reduce the highest temperature on the surface of the thermal isolation structure. Thus, high temperature hot spot area caused by the heat generating element is prevented to be formed on the surface of the electronic device.
    Type: Application
    Filed: March 26, 2009
    Publication date: September 30, 2010
    Applicant: MiTAC TECHNOLOGY CORP.
    Inventors: Wei-Chung HSIAO, Tom WANG
  • Patent number: 7554827
    Abstract: A solid state relay is provided herein, which utilizes an electromagnetic coupling device for galvanic isolation and providing feedback from the output side to the system side. The solid state relay contains a system-side driving circuit, an electromagnetic coupling device, and an output-side control circuit. The electromagnetic coupling device contains at least a system-side electromagnetic coupling element, a first output-side electromagnetic coupling element, and a second output-side electromagnetic coupling element. The system-side driving circuit is connected to the system-side electromagnetic coupling element, and takes the ON/OFF digital control signals from a digital system as input to turn on and off its driving to the system-side electromagnetic coupling element.
    Type: Grant
    Filed: May 19, 2006
    Date of Patent: June 30, 2009
    Assignee: Netio Technology Co., Ltd.
    Inventor: Tom Wang
  • Publication number: 20070268649
    Abstract: A solid state relay is provided herein, which utilizes an electromagnetic coupling device for galvanic isolation and providing feedback from the output side to the system side. The solid state relay contains a system-side driving circuit, an electromagnetic coupling device, and an output-side control circuit. The electromagnetic coupling device contains at least a system-side electromagnetic coupling element, a first output-side electromagnetic coupling element, and a second output-side electromagnetic coupling element. The system-side driving circuit is connected to the system-side electromagnetic coupling element, and takes the ON/OFF digital control signals from a digital system as input to turn on and off its driving to the system-side electromagnetic coupling element.
    Type: Application
    Filed: May 19, 2006
    Publication date: November 22, 2007
    Inventor: Tom Wang
  • Publication number: 20060156177
    Abstract: An apparatus and method for recovering from soft errors in register files is disclosed. In one embodiment, an apparatus includes a register file and error-correcting-code generation logic. Each register in the register file has bits to store data and bits to store an error-correcting-code value for the data.
    Type: Application
    Filed: December 29, 2004
    Publication date: July 13, 2006
    Inventors: Sailesh Kottapalli, Swati Nadkarni, Tom Wang
  • Patent number: 7039026
    Abstract: A wireless transmit receive unit (WTRU) and a method used in a WTRU for controlling wireless communication Packet Switched (PS) data flow on radio access bearers (RABs) between a radio link controller (RLC) and an Internet Protocol Relay (IPR). A combined Radio Access Bearer Manager/Packet Data Convergence Protocol (RABM/PDCP) component provides interface control with a Session Manager (SM) and a radio resource center (RRC) such that the processing of PS data and control of each RAB is associated with the processing of PS data and control of a single radio bearer (RB).
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: May 2, 2006
    Assignee: Interdigital Technology Corporation
    Inventors: William Francoeur, Peter Shaomin Wang, Shiehlie Tom Wang
  • Patent number: 5357673
    Abstract: In a semiconductor device encapsulation assembly (50; 60), a semiconductor device (21), preferably a pressure transducer, is mounted on a base (11) in a cavity (20) formed by the base and surrounding walls (15). Electrical connections, preferably wire bonds (27), connect the semiconductor device to conductor paths (28) on the base within the cavity. An encapsulation material comprising a thixotropic fluorosiloxane material (51; 61) is applied in the cavity and completely covers the semiconductor device and the electrical connections. This structure enables the semiconductor device to withstand typical automotive contaminants, such as mild acids and gasoline, while also preventing erratic semiconductor device operation due to bubbles which may be drawn into the encapsulation material.
    Type: Grant
    Filed: October 1, 1993
    Date of Patent: October 25, 1994
    Assignee: Motorola, Inc.
    Inventors: Anthony J. Polak, David J. Schifferle, Tom Wang
  • Patent number: 5258650
    Abstract: In a semiconductor device encapsulation assembly (50; 60), a semiconductor device (21), preferably a pressure transducer, is mounted on a base (11) in a cavity (20) formed by the base and surrounding walls (15). Electrical connections, preferably wire bonds (27), connect the semiconductor device to conductor paths (28) on the base within the cavity. An encapsulation material comprising a thixotropic fluorosiloxane material (51; 61) is applied in the cavity and completely covers the semiconductor device and the electrical connections. This structure enables the semiconductor device to withstand typical automotive contaminants, such as mild acids and gasoline, while also preventing erratic semiconductor device operation due to bubbles which may be drawn into the encapsulation material.
    Type: Grant
    Filed: August 26, 1991
    Date of Patent: November 2, 1993
    Assignee: Motorola, Inc.
    Inventors: Anthony J. Polak, David J. Schifferle, Tom Wang