Patents by Inventor Tom Wayson

Tom Wayson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6348233
    Abstract: A method for minimizing formation of cracks at junctions between conductive vias and conductive lines in line-to-via connections on a substrate. The method comprises providing a transition zone connected between a base section of the line and a cap, the transition zone providing a volume of conductive paste during a conductive paste screen printing operation that is greater than the volume provided by the base section being directly connected to the cap. In particular, the transition zone volume is an effective amount to prevent necking of the conductive line into the via when the mask is misaligned to the substrate within an expected alignment tolerance. The transition zone may comprise a jogged end extending from the base section to the cap at an angle to the line, or a flared end extending from the base section. Line-to-via connection structures, patterns on a mask for making such structures, and masks having such patterns are also disclosed.
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: February 19, 2002
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey A. Brody, Harry D. Cox, John Garant, Hsichang Liu, Paul G. McLaughlin, Tom Wayson
  • Publication number: 20010051210
    Abstract: A method for minimizing formation of cracks at junctions between conductive vias and conductive lines in line-to-via connections on a substrate. The method comprises providing a transition zone connected between a base section of the line and a cap, the transition zone providing a volume of conductive paste during a conductive paste screen printing operation that is greater than the volume provided by the base section being directly connected to the cap. In particular, the transition zone volume is an effective amount to prevent necking of the conductive line into the via when the mask is misaligned to the substrate within an expected alignment tolerance. The transition zone may comprise a jogged end extending from the base section to the cap at an angle to the line, or a flared end extending from the base section. Line-to-via connection structures, patterns on a mask for making such structures, and masks having such patterns are also disclosed.
    Type: Application
    Filed: March 21, 2001
    Publication date: December 13, 2001
    Inventors: Jeffrey A. Brody, Harry D. Cox, John Garant, Hsichang Liu, Paul G. McLaughlin, Tom Wayson
  • Patent number: 6217989
    Abstract: A method for minimizing formation of cracks at junctions between conductive vias and conductive lines in line-to-via connections on a substrate. The method comprises providing a transition zone connected between a base section of the line and a cap, the transition zone providing a volume of conductive paste during a conductive paste screen printing operation that is greater than the volume provided by the base section being directly connected to the cap. In particular, the transition zone volume is an effective amount to prevent necking of the conductive line into the via when the mask is misaligned to the substrate within an expected alignment tolerance. The transition zone may comprise a jogged end extending from the base section to the cap at an angle to the line, or a flared end extending from the base section. Line-to-via connection structures, patterns on a mask for making such structures, and masks having such patterns are also disclosed.
    Type: Grant
    Filed: December 10, 1999
    Date of Patent: April 17, 2001
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey A. Brody, Harry D. Cox, John Garant, Hsichang Liu, Paul G. McLaughlin, Tom Wayson