Patents by Inventor Tom Yu-Tang Lin
Tom Yu-Tang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10696851Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.Type: GrantFiled: November 23, 2016Date of Patent: June 30, 2020Assignee: Hitachi Chemical Co., Ltd.Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
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Patent number: 10233338Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.Type: GrantFiled: November 23, 2016Date of Patent: March 19, 2019Assignee: PLANT PV, Inc.Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
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Patent number: 10000645Abstract: A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.Type: GrantFiled: November 23, 2016Date of Patent: June 19, 2018Assignee: PLANT PV, Inc.Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
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Patent number: 9741878Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.Type: GrantFiled: November 23, 2016Date of Patent: August 22, 2017Assignee: PLANT PV, Inc.Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
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Publication number: 20170148944Abstract: A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.Type: ApplicationFiled: November 23, 2016Publication date: May 25, 2017Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
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Publication number: 20170145224Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.Type: ApplicationFiled: November 23, 2016Publication date: May 25, 2017Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
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Publication number: 20170148937Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.Type: ApplicationFiled: November 23, 2016Publication date: May 25, 2017Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
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Publication number: 20170148933Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.Type: ApplicationFiled: November 23, 2016Publication date: May 25, 2017Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters