Abstract: A method for the mechanical soft-soldering of heavy metals using a novel fluxing composition is described. The fluxing composition comprises up to 3% by weight of an organic acid based fluxing agent, with the fluxing agent being dissolved in an organic solvent. Succinic acid may be used as the fluxing agent and isopropanol as the solvent. The solution can contain non-ionogenic wetting agents. The solution also contains a carrier component which can be removed by the liquid solder during the soldering process and which effects a removal of the residues of the fluxing agent at the end of the soldering process. The fluxing solution is cleaned through fine-filtration prior to use. The carrier component comprises an ester or an organic acid, said carrier component being liquid at the soldering temperature. Through the use of the carrier component, the formation of bridges and lugs is eliminated.

Abstract: For protecting the surface of a soldering bath a covering means is used which comprises two phases (3,4), which are placed one on top of the other, are not soluble in each other and are liquid at the soldering temperature. The bottom phase (3) is produced by spreading over the top phase (4), which consists of a liquid synthetic polyalphaolefin, a powder of a chemically active component of sebacic acid and/or suberic acid which is solid at room temperature and liquid at the soldering temperature.