Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: A method and apparatus is disclosed for enabling a coupling of at least one optical fiber with an optoelectronic device. The apparatus comprises at least one v-groove for receiving at least one optical fiber. A first end of the apparatus is then polished at a predetermined angle in order to enable an optical coupling with the optoelectronic device.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.

Abstract: An optical connector and a manufacturing method are disclosed. The method for manufacturing an optical connector achieving a mechanical coupling comprises embedding a length of at least one optical fiber in a body to form an assembly. It also comprises to remove, at a first end of the assembly, a portion to provide a beveled surface on a corresponding first end of the optical fiber at which light is reflected for a side coupling. Also, at a portion of a side of the assembly near the first end, the method comprises creating an optical surface to provide a flat coupling surface for said side coupling. The method also comprises removing, at a second end of the assembly, a portion to provide a flat abutment surface including a corresponding second end of the at least one optical fiber. The method also comprises providing at the second end of the assembly a mating structure for precision connecting with a complementary connector in which an optical waveguide is end-coupled with at least one of the optical fiber.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: A method and apparatus is disclosed for creating an optical ferrule. A mechanical coupling of the ferrule is achieved, at a first end of the ferrule, using at least two dowels while an optical coupling of the ferrule with an optical device is achieved, at a second end of the ferrule, using a total internal reflection.

Abstract: A method and apparatus is disclosed for enabling a coupling of at least one optical fiber with an optoelectronic device. The apparatus comprises at least one v-groove for receiving at least one optical fiber. A first end of the apparatus is then polished at a predetermined angle in order to enable an optical coupling with the optoelectronic device.

Abstract: A ferrule for holding an array of optical fiber sections comprises a longitudinal cavity and an edge face. The longitudinal cavity receives the array of fiber sections with the end faces thereof arranged in a line and coplanar to each other. The edge face includes a first face portion perpendicular to the longitudinal axes of the fiber sections, and a second bevelled face portion adjacent to the first face portion. The end faces of the fiber sections emerge from the first face portion. The ferrule is used in a connector structure including a bar with a top surface on which optoelectronic devices are arranged in a line and bonding contacts are disposed. An alignment assembly between the ferrule and the bar aligns the end faces of the fiber sections with respective optoelectronic devices. The bevelled face portion provides for clearance to enable unobstructed passage of wire-bonds connected to the bonding contacts.