Patents by Inventor Tomhiko Kaneko

Tomhiko Kaneko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
    Patent number: 8145342
    Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: March 27, 2012
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura, Tomhiko Kaneko, Takuto Kazama